The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Provided are copolymers which provide improved overall performance in terms of fuel economy and wet grip performance, as well as rubber compositions and tires containing the copolymers. Included is a copolymer obtained by copolymerizing an aromatic vinyl compound, a conjugated diene compound, and a compound represented by the formula (1) below or by copolymerizing a conjugated diene compound and a compound represented by the formula (1) below, the copolymer having a weight average molecular weight of 1.0×10.sup.3 to 2.5×10.sup.6, ##STR00001##
wherein R.sup.1 and R.sup.2 may be the same or different and each represents a functional group containing at least two selected from the group consisting of carbon, hydrogen, and silicon, and R.sup.1 and R.sup.2 may be joined together to form a ring structure.

Provided are copolymers which provide improved overall performance in terms of fuel economy and wet grip performance, as well as rubber compositions and tires containing the copolymers. Included is a copolymer obtained by copolymerizing an aromatic vinyl compound, a conjugated diene compound, and a compound represented by the formula (1) below or by copolymerizing a conjugated diene compound and a compound represented by the formula (1) below, the copolymer having a weight average molecular weight of 1.0×10.sup.3 to 2.5×10.sup.6, ##STR00001##
wherein R.sup.1 and R.sup.2 may be the same or different and each represents a functional group containing at least two selected from the group consisting of carbon, hydrogen, and silicon, and R.sup.1 and R.sup.2 may be joined together to form a ring structure.

Methods and materials are described for preparing organic-inorganic hybrid gel compositions where a sulfur-containing cross-linking agent covalently links the organic and inorganic components. The gel compositions are further dried to provide porous gel compositions and aerogels. The mechanical and thermal properties of the dried gel compositions are also disclosed.

Methods and materials are described for preparing organic-inorganic hybrid gel compositions where a sulfur-containing cross-linking agent covalently links the organic and inorganic components. The gel compositions are further dried to provide porous gel compositions and aerogels. The mechanical and thermal properties of the dried gel compositions are also disclosed.

The present invention provides a rubber composition obtained by kneading a rubber component, a vulcanization accelerator, silica, and a compound represented by the following formula (I): ##STR00001##
wherein the groups are as defined in the DESCRIPTION.

The present invention provides a rubber composition obtained by kneading a rubber component, a vulcanization accelerator, silica, and a compound represented by the following formula (I): ##STR00001##
wherein the groups are as defined in the DESCRIPTION.

The invention relates to silane mixtures comprising a silane of the formula I
(R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—(S—R.sup.4).sub.n—S.sub.x—R.sup.5  (I)
and a silane of the formula II
(R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—Si(R.sup.1).sub.y(R.sup.2).sub.3-y  (II)
where the molar ratio of silane of the formula I to silane of the formula II is 15:85-90:10. The silane mixture according to the invention can be prepared by mixing the silanes of the formula I and silanes of the formula II.

The invention relates to silane mixtures comprising a silane of the formula I
(R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—(S—R.sup.4).sub.n—S.sub.x—R.sup.5  (I)
and a silane of the formula II
(R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—Si(R.sup.1).sub.y(R.sup.2).sub.3-y  (II)
where the molar ratio of silane of the formula I to silane of the formula II is 15:85-90:10. The silane mixture according to the invention can be prepared by mixing the silanes of the formula I and silanes of the formula II.

The invention relates to silane mixtures comprising a silane of the formula I
((R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—SH  (I)
and a silane of the formula II
(R.sup.1).sub.y(R.sup.2).sub.3-ySi—R.sup.3—(S—R.sup.4).sub.z—Si(R.sup.1).sub.y(R.sup.2).sub.3-y  (II)
where the molar ratio of silane of the formula I to silane of the formula II is 20:80-85:15. The silane mixture according to the invention can be prepared by mixing the silanes of the formula I and silanes of the formula II.