Disclosed herein is a polyamide composition (PC) including at least one polyamide (A) and at least one carbon black (B), where the surface layer of the at least one carbon black (B) includes not more than 2% by weight of oxygen, based on the total weight of the surface layer of the at least one carbon black (B), and where the weight of oxygen in the surface layer is measured by X-ray photoelectron spectroscopy at an X-ray penetration depth of 2 to 10 nm. Further disclosed herein are a process for producing the polyamide composition (PC), a process for producing a moulded article by forming the polyamide composition (PC), a moulded article including the polyamide composition (PC), and a method of using the at least one carbon black (B) in a polyamide composition (PC) for increasing the shrinkage of moulded articles made from the polyamide composition (PC).

Provided is a curable composition including oxide particles that include at least indium and tin, and to which a ligand having a hydrocarbon group and a binding site to the oxide particles is bonded; and a polymerizable compound, in which a content of the oxide particles in the composition is 18 mass % or more with respect to a total solid content of the composition; and a cured product of the curable composition or a lens unit including the cured product.

An ink contains water, an organic solvent, a polyurethane resin, and a cyclic ester including a structure represented by Chemical formula I, wherein the proportion of the cyclic ester having a crystal having a particle diameter of 1 μm or greater is less than 4 ppm of the total of the ink after the ink is allowed to stand at a temperature range of from 20 to 30 degrees C. for 30 days. ##STR00001##

This invention relates to a multi-part kit system to repair damaged products used in industrial applications, comprising a part A which comprises A1) MDI prepolymer, A2) fumed silica and A3) plasticizer; a part B which comprises B1) hydroquinone di-(2-hydroxyethyl)ether and B2) plasticizer; and a part C which comprises C1) polyol, C2) optionally catalyst and C3) optionally plasticizer.

An adhesive sheet is a thermally expandable and thermosetting adhesive sheet including a substrate and a first layer provided on at least one surface of the substrate. The first layer contains an adhesive portion having an adhesive composition and thermally expandable first particles contained within the adhesive composition, and second particles provided in the adhesive portion and having different materials from those of the first particles, and each of the second particles is larger than each of the first particles.

A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D.sub.50 of the solder particles is 12 μm or less, a particle size D.sub.50 of the flux particles is 30 μm or less, and a ratio of a particle size D.sub.90 of the solder particles and a particle size D.sub.90 of the flux particles to the sheet thickness T is 0.95 or less.

The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, the pressure-sensitive adhesive sheet having a transmittance for light having wavelengths of 380-600 nm of 25% or less, transmittance for light having wavelengths 800-2,500 nm of 60% or greater, and a change in light transmittance in the wavelength range of 600 to 800 nm of 0.1%/nm or greater.

A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material satisfies (i) and/or (ii). (i) P.sub.2 is 500 or more. (ii) The composite material has a heat conductivity of 0.5 W/(m.Math.K) or more and a thickness of 0.5 mm to 2.5 mm, the void have an average diameter of 50 μm to 1500 μm, and P.sub.3 is 70% to 90%. P.sub.2=the heat conductivity [W/(m.Math.K)] of the composite material×P.sub.3×100/an amount [volume %] of the inorganic particles P.sub.3 [%]=(F.sub.0−F.sub.1)×100/F.sub.0

Provided is a method for producing surface-treated silica powder that has excellent gap permeability and that allows a resin composition to have low viscosity in a case where the surface-treated silica powder is used as a resin filler, for example, for a semiconductor sealant. A surface treatment agent is brought into contact with silica powder such that: (1) a cumulative 50 mass % diameter D.sub.50 of a mass-based particle size distribution obtained by a centrifugal sedimentation method is 300 nm to 500 nm (preferably 330 nm to 400 nm); (2) a loose bulk density is 250 kg/m.sup.3 to 400 kg/m.sup.3 (preferably 270 kg/m.sup.3 to 350 kg/m.sup.3); and (3) {(D.sub.90−D.sub.50)/D.sub.50}×100 is 30% to 45% (preferably 33% to 42%), to modify the surface of the silica powder, so that surface-treated silica powder is produced.

Provided is a glass fiber-reinforced resin plate that comprises glass fiber having a flat cross-sectional shape and has an improved elastic modulus in the TD direction. The glass fiber-reinforced resin plate comprises a glass fiber having a flat cross-sectional shape and a resin, in which the glass fiber having a flat cross-sectional shape has a minor axis of 4.5 to 10.5 μm, a major axis of 22.0 to 80.0 μm, a ratio of the major axis to the minor axis (major axis/minor axis) R in the range of 4.5 to 10.0; the glass fiber content C is 5.0 to 75.0% by mass; the thickness H is in the range of more than 0.5 mm and 10.0 mm or less; and the C and H satisfy the following formula (1).

30.0≤H×C≤120.0  (1).