A multilayer optical film including: an A layer formed of an alicyclic structure-containing polymer resin; and a B layer disposed on at least one surface of the A layer to be in direct contact therewith, the B layer serving as a masking layer, wherein the B layer is a cured product of a material Y including a dispersion of a crosslinkable polymer (a) and solid particles (b), and the B layer has a thickness tB of 10 μm or more and 25 μm or less. A production method including the steps of applying the material Y onto a surface of the A layer, to form a layer of the material Y; and curing the layer of the material Y.

A multilayer optical film including: an A layer formed of an alicyclic structure-containing polymer resin; and a B layer disposed on at least one surface of the A layer to be in direct contact therewith, the B layer serving as a masking layer, wherein the B layer is a cured product of a material Y including a dispersion of a crosslinkable polymer (a) and solid particles (b), and the B layer has a thickness tB of 10 μm or more and 25 μm or less. A production method including the steps of applying the material Y onto a surface of the A layer, to form a layer of the material Y; and curing the layer of the material Y.

The present invention is directed to a new cable having at least one insulation layer, to a process for producing such cable as well as to the use of a polymeric-nucleating agent for increasing the crystallization temperature of a polymer composition being part of an insulation layer of such a cable and the use of such a cable as communication cable and/or electrical cable.

The present invention is directed to a new cable having at least one insulation layer, to a process for producing such cable as well as to the use of a polymeric-nucleating agent for increasing the crystallization temperature of a polymer composition being part of an insulation layer of such a cable and the use of such a cable as communication cable and/or electrical cable.

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C.sub.32-C.sub.40 dimer acid, and at least one C.sub.4-C.sub.12-diamine.

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C.sub.32-C.sub.40 dimer acid, and at least one C.sub.4-C.sub.12-diamine.

A composition comprising polypropylene having a high melt strength suitable for an injection stretch blow molding (ISBM) process is provided. Such a composition includes a polypropylene (PP) copolymer having a branched structure. The PP copolymer is a random copolymer derived from propylene and at least one comonomer selected from ethylene, any C.sub.4-C.sub.8 alpha-olefin, or any combinations thereof. The composition has a melt flow index in a range of from 8 g/10 minutes to 30 g/10 minutes. A resulting fabricated article, a method of making the composition, and a method of using the composition are also provided.

A composition comprising polypropylene having a high melt strength suitable for an injection stretch blow molding (ISBM) process is provided. Such a composition includes a polypropylene (PP) copolymer having a branched structure. The PP copolymer is a random copolymer derived from propylene and at least one comonomer selected from ethylene, any C.sub.4-C.sub.8 alpha-olefin, or any combinations thereof. The composition has a melt flow index in a range of from 8 g/10 minutes to 30 g/10 minutes. A resulting fabricated article, a method of making the composition, and a method of using the composition are also provided.

Described herein are polyester compositions including a semi-aromatic, semi-crystalline polyester, a polyolefin and a glass fiber having a low D.sub.k and low D.sub.f (“low D.sub.k/D.sub.f glass fiber”). The concentrations of the semi-crystalline polyester and polyolefin are selected such that the polyester weight ratio is from 70% to 95%. It was surprisingly found that when the polyester weight ratio was in the aforementioned range, the polyester compositions had an excellent balance of dielectric properties (D.sub.k and D.sub.f) and mechanical properties (e.g., notched impact strength). It was also surprisingly found that when polyester composition further included high D.sub.k/D.sub.f glass fibers, the balance of dielectric and mechanical properties was still further improved when the polyester weight ratio was from 75% to 93%. Due at least in part to the excellent balance of dielectric and mechanical properties, the polyester compositions can be desirably incorporated into mobile electronic device components.

Described herein are polyester compositions including a semi-aromatic, semi-crystalline polyester, a polyolefin and a glass fiber having a low D.sub.k and low D.sub.f (“low D.sub.k/D.sub.f glass fiber”). The concentrations of the semi-crystalline polyester and polyolefin are selected such that the polyester weight ratio is from 70% to 95%. It was surprisingly found that when the polyester weight ratio was in the aforementioned range, the polyester compositions had an excellent balance of dielectric properties (D.sub.k and D.sub.f) and mechanical properties (e.g., notched impact strength). It was also surprisingly found that when polyester composition further included high D.sub.k/D.sub.f glass fibers, the balance of dielectric and mechanical properties was still further improved when the polyester weight ratio was from 75% to 93%. Due at least in part to the excellent balance of dielectric and mechanical properties, the polyester compositions can be desirably incorporated into mobile electronic device components.