Patent classifications
C08L53/025
Thermoplastic resin composition for wire-coating and heat resistant wire
The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
Thermoplastic resin composition for wire-coating and heat resistant wire
The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
Polyolefin elastomer blends for elastomeric films
A thermoplastic elastomer compound includes a polyolefin elastomer blend of at least two different polyolefin elastomers, styrene-ethylene/butylene-styrene block copolymer, and plasticizer. The compound has a Melt Flow Rate (230° C., 2.16 kg) of no less than about 5 g/10 min and a Melt Flow Rate (190° C., 2.16 kg) of no less than about 1 g/10 min. Elastomeric films formed from the compound can be used in place of elastomeric films based on styrene-isoprene-styrene (SIS) block copolymers to make components of disposable hygiene articles.
Polyolefin elastomer blends for elastomeric films
A thermoplastic elastomer compound includes a polyolefin elastomer blend of at least two different polyolefin elastomers, styrene-ethylene/butylene-styrene block copolymer, and plasticizer. The compound has a Melt Flow Rate (230° C., 2.16 kg) of no less than about 5 g/10 min and a Melt Flow Rate (190° C., 2.16 kg) of no less than about 1 g/10 min. Elastomeric films formed from the compound can be used in place of elastomeric films based on styrene-isoprene-styrene (SIS) block copolymers to make components of disposable hygiene articles.
Protective film
A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.
Protective film
A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.
RESIN COMPOSITION, RESIN COMPOSITION MOLDED BODY, AND POWER CABLE
A resin composition contains propylene, ethylene, and styrene, and has a melting point of 140° C. or more and 150° C. or less, and the enthalpy of fusion of the resin composition is 55 J/g or more and 90 J/g or less.
RESIN COMPOSITION, RESIN COMPOSITION MOLDED BODY, AND POWER CABLE
A resin composition contains propylene, ethylene, and styrene, and has a melting point of 140° C. or more and 150° C. or less, and the enthalpy of fusion of the resin composition is 55 J/g or more and 90 J/g or less.
ALKALI-DISPERSIBLE HOT MELT PRESSURE-SENSITIVE ADHESIVE
The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain the label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the thermoplastic block copolymer (A) comprises (A1) a styrene-based block copolymer having a styrene content of less than 40 mass % and the tackifier resin (B) comprises an α-methylstyrene-based resin.
ALKALI-DISPERSIBLE HOT MELT PRESSURE-SENSITIVE ADHESIVE
The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain the label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the thermoplastic block copolymer (A) comprises (A1) a styrene-based block copolymer having a styrene content of less than 40 mass % and the tackifier resin (B) comprises an α-methylstyrene-based resin.