Patent classifications
C08L71/10
RESIN COMPOSITION FOR FLEXIBLE DEVICE, FILM-LIKE ADHESIVE FOR FLEXIBLE DEVICE, ADHESIVE SHEET FOR FLEXIBLE DEVICE, AND METHOD OF PRODUCING FLEXIBLE DEVICE
A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less, a film-like adhesive using the resin composition, an adhesive sheet having a laminated structure of the film-like adhesive and a flexible base material, and a method of producing a flexible device.
Polymer, electrolyte including the same, and lithium battery including the polymer
Provided are a polymer represented by Formula 1, an electrolyte including the same, and a lithium battery including the polymer.
Polymer, electrolyte including the same, and lithium battery including the polymer
Provided are a polymer represented by Formula 1, an electrolyte including the same, and a lithium battery including the polymer.
RESIN COMPOSITION AND MOLDED ARTICLE
A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
RESIN COMPOSITION AND MOLDED ARTICLE
A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
RESIN COMPOSITION AND MOLDED ARTICLE
A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION
A polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the formulas (1A) and (1B); or a polycyclic polyphenolic resin having repeating units derived from an aromatic hydroxy compound represented by the formula (C-1A), wherein the repeating units are linked to each other by a direct bonding between aromatic rings:
##STR00001##
wherein in the formula (1A), R.sup.1 is a 2n-valent group having 1 to 60 carbon atoms or a single bond, each R.sup.2 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, an amino group, a nitro group, a cyano group, a nitro group, a heterocyclic group, a carboxyl group or a hydroxy group, and each m is independently an integer of 0 to 3; each n is independently an integer of 1 to 4; and in the formula (1B), R.sup.2 and m are as defined in the formula (1A), and
##STR00002##
wherein in the formula (C-1A), R.sup.1 is a 2n-valent group having 1 to 60 carbon atoms or a single bond, each R.sup.2 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, an amino group, a nitro group, a cyano group, a nitro group, a heterocyclic group, a carboxyl group or a hydroxy group, and each m is independently an integer of 0 to 9; and n is an integer of 1 to 4, and each p is independently an integer of 0 to 3.
POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION
A polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the formulas (1A) and (1B); or a polycyclic polyphenolic resin having repeating units derived from an aromatic hydroxy compound represented by the formula (C-1A), wherein the repeating units are linked to each other by a direct bonding between aromatic rings:
##STR00001##
wherein in the formula (1A), R.sup.1 is a 2n-valent group having 1 to 60 carbon atoms or a single bond, each R.sup.2 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, an amino group, a nitro group, a cyano group, a nitro group, a heterocyclic group, a carboxyl group or a hydroxy group, and each m is independently an integer of 0 to 3; each n is independently an integer of 1 to 4; and in the formula (1B), R.sup.2 and m are as defined in the formula (1A), and
##STR00002##
wherein in the formula (C-1A), R.sup.1 is a 2n-valent group having 1 to 60 carbon atoms or a single bond, each R.sup.2 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, an amino group, a nitro group, a cyano group, a nitro group, a heterocyclic group, a carboxyl group or a hydroxy group, and each m is independently an integer of 0 to 9; and n is an integer of 1 to 4, and each p is independently an integer of 0 to 3.
Method of making a PEEK-PEmEK copolymer and copolymer obtained from the method
A method of making a PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55, the PEEK-PEmEK copolymer obtained from the method and the polymer composition including the PEEK-PEmEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.
ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM
An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.