Patent classifications
C08L77/08
Polymer compounds containing multiple hydroxyl groups, methods for producing the same, and complex containing the same
Disclosed are a novel polymer compound containing multiple hydroxyl groups, a method for producing the same, and a complex having a crosslinked structure of the polymer compound. The polymer compound includes a repeating unit represented by a following Chemical Formula 1: ##STR00001## where in the Chemical Formula 1, n denotes an integer of 10 to 10,000.
Polymer compounds containing multiple hydroxyl groups, methods for producing the same, and complex containing the same
Disclosed are a novel polymer compound containing multiple hydroxyl groups, a method for producing the same, and a complex having a crosslinked structure of the polymer compound. The polymer compound includes a repeating unit represented by a following Chemical Formula 1: ##STR00001## where in the Chemical Formula 1, n denotes an integer of 10 to 10,000.
Moisture curable polyamides and methods for using the same
The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
Moisture curable polyamides and methods for using the same
The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
Paving binder
A paving binder according to the present invention is used for a paving mixture for forming a pavement, including a polyamide resin having a weight average molecular weight, as measured by gel permeation chromatography of 2,000 or more and 10,000 or less and having an area, corresponding to a component having a molecular weight of 20,000 or more and 500,000 or less, of 0.5% or more and 12% or less of a total area in a chromatogram of molecular weight distribution as measured by gel permeation chromatography. Thus, tolerance for a severe temperature condition or loading condition can be improved, while ensuring convenience from the standpoint of laying such that the laying can be made by the conventional machine composition or laying system.
Paving binder
A paving binder according to the present invention is used for a paving mixture for forming a pavement, including a polyamide resin having a weight average molecular weight, as measured by gel permeation chromatography of 2,000 or more and 10,000 or less and having an area, corresponding to a component having a molecular weight of 20,000 or more and 500,000 or less, of 0.5% or more and 12% or less of a total area in a chromatogram of molecular weight distribution as measured by gel permeation chromatography. Thus, tolerance for a severe temperature condition or loading condition can be improved, while ensuring convenience from the standpoint of laying such that the laying can be made by the conventional machine composition or laying system.
Paving binder
A paving binder according to the present invention is used for a paving mixture for forming a pavement, including a polyamide resin having a weight average molecular weight, as measured by gel permeation chromatography of 2,000 or more and 10,000 or less and having an area, corresponding to a component having a molecular weight of 20,000 or more and 500,000 or less, of 0.5% or more and 12% or less of a total area in a chromatogram of molecular weight distribution as measured by gel permeation chromatography. Thus, tolerance for a severe temperature condition or loading condition can be improved, while ensuring convenience from the standpoint of laying such that the laying can be made by the conventional machine composition or laying system.
Thermoplastic Composition Comprising a Polyamide and a Polysiloxane
A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: 1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and 3a) mixing the obtained mixture of step 2a) preferably at 80° to 180° C., more preferably 110 to 140° C.
Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.
Polymer composition
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.
Polymer composition
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.