The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

Described herein is a polyamide composition and a tubular or pipe multilayer structure including the same.

Described herein is a polyamide composition and a tubular or pipe multilayer structure including the same.

The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan δ of not more than 8.30×10−3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan δ of not more than 8.30×10−3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

A coating composition comprising epoxidized vegetable oil, an amine terminated polyamide and a silicone resin is disclosed. Substrates coated at least in part with such coatings are also disclosed.

A coating composition comprising epoxidized vegetable oil, an amine terminated polyamide and a silicone resin is disclosed. Substrates coated at least in part with such coatings are also disclosed.

A rheology control agent for a curable composition may include: a diamide compound (A) and/or a hydrogenated castor oil (A′), the diamide compound (A) being obtained by condensation reaction between a diamine component (A1) and a monocarboxylic acid component (A2); and a polyamide compound (B) obtained by polycondensation of an amine component (B1) and a carboxylic acid component (B2). The diamine component (A1) may be selected from the group consisting of diamines with 2 to 12 carbon atoms. The monocarboxylic acid component (A2) may be selected from the group consisting of hydrogenated castor oil fatty acids and linear saturated fatty acids. The polyamide compound (B) may have a weight-average molecular weight from 2,000 to 21,000. A cured product of the curable composition may be used for a sealant or an adhesive.