A rheology control agent for a curable composition may include: a diamide compound (A) and/or a hydrogenated castor oil (A′), the diamide compound (A) being obtained by condensation reaction between a diamine component (A1) and a monocarboxylic acid component (A2); and a polyamide compound (B) obtained by polycondensation of an amine component (B1) and a carboxylic acid component (B2). The diamine component (A1) may be selected from the group consisting of diamines with 2 to 12 carbon atoms. The monocarboxylic acid component (A2) may be selected from the group consisting of hydrogenated castor oil fatty acids and linear saturated fatty acids. The polyamide compound (B) may have a weight-average molecular weight from 2,000 to 21,000. A cured product of the curable composition may be used for a sealant or an adhesive.

A rheology control agent for a curable composition includes: a diamide compound (A) and/or a hydrogenated castor oil (A′), the diamide compound (A) being obtained by condensation reaction between a diamine component (A1) and a monocarboxylic acid component (A2); and a polyamide compound (B) obtained by polycondensation of an amine component (B1) and a carboxylic acid component (B2). The amine component (B1) contains at least one amine selected from the group consisting of a diamine and a triamine having 2 to 54 carbon atoms. The carboxylic acid component (B2) contains at least one carboxylic acid selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid having 4 to 54 carbon atoms. The polyamide compound (B) is obtained by polycondensation of at least one of the amine component (B1) and the carboxylic acid component (B2) containing polymerized fatty acids.

A rheology control agent for a curable composition includes: a diamide compound (A) and/or a hydrogenated castor oil (A′), the diamide compound (A) being obtained by condensation reaction between a diamine component (A1) and a monocarboxylic acid component (A2); and a polyamide compound (B) obtained by polycondensation of an amine component (B1) and a carboxylic acid component (B2). The amine component (B1) contains at least one amine selected from the group consisting of a diamine and a triamine having 2 to 54 carbon atoms. The carboxylic acid component (B2) contains at least one carboxylic acid selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid having 4 to 54 carbon atoms. The polyamide compound (B) is obtained by polycondensation of at least one of the amine component (B1) and the carboxylic acid component (B2) containing polymerized fatty acids.

The use, for seamless textile assembly by printing, of a copolyamide including: a) at least one hard segment obtained by polycondensation of at least one of the following: (i) an α,ω-aminocarboxylic acid; (ii) a lactam; and/or (iii) an aliphatic diacid with 6 to 22 carbon atoms and at least one aliphatic diamine with 2 to 14 carbon atoms, and, optionally, b) at least one soft segment obtained by polycondensation of at least one diacid with 4 to 44 carbon atoms with at least one diamine chosen from diamines with 2 to 44 carbon atoms and polyoxyalkylene diamines, the copolyamide having a melting temperature Tm above 80° C. and below 210° C. and a viscosity at 170° C., as measured according to standard ASTM D3236-88 (2009), using a Brookfield rheometer with SC 4-27 spindle, of between 5 Pa.Math.s and 100-200 Pa.Math.s.

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C.sub.32-C.sub.40 dimer acid, and at least one C.sub.4-C.sub.12-diamine.

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C.sub.32-C.sub.40 dimer acid, and at least one C.sub.4-C.sub.12-diamine.

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C.sub.32-C.sub.40 dimer acid, and at least one C.sub.4-C.sub.12-diamine.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.