Disclosed herein is a method for improving Inclined Plane tracking (IPT) property at voltage higher than 1 kV by using a polyamide composition. The polyamide composition includes a) 10 to 50 wt % of at least one semi-crystalline aliphatic polyamide having on average, from 3 to 5 carbon atoms, not including the carbon atom in the carbonyl group, per amide group; b) 1 to 40 wt % of at least one long-chain aliphatic polyamide having on average equal to or more than 6 carbon atoms, not including the carbon atom in the carbonyl group, per amide group; c) 0 to 35 wt % of flame retardant; d) 0 to 50 wt % of fibrous and/or particulate filler; e) 1 to 25 wt % of impact modifier, and f) 0 to 20 wt % of other additives.

Disclosed herein is a method for improving Inclined Plane tracking (IPT) property at voltage higher than 1 kV by using a polyamide composition. The polyamide composition includes a) 10 to 50 wt % of at least one semi-crystalline aliphatic polyamide having on average, from 3 to 5 carbon atoms, not including the carbon atom in the carbonyl group, per amide group; b) 1 to 40 wt % of at least one long-chain aliphatic polyamide having on average equal to or more than 6 carbon atoms, not including the carbon atom in the carbonyl group, per amide group; c) 0 to 35 wt % of flame retardant; d) 0 to 50 wt % of fibrous and/or particulate filler; e) 1 to 25 wt % of impact modifier, and f) 0 to 20 wt % of other additives.

Coating formulations capable of forming coatings exhibiting minimal or no blushing may comprise an aqueous carrier fluid, an amine-terminated polyamide, a resin, an acid catalyst, and a water-soluble fluorescent compound. The resin may comprise at least one compound selected from the group consisting of an aminoplast melamine-based resin, a benzoguanamine-based resin, a cresolformaldehyde-based resin, and any combination thereof. Such coating formulations may be curable in at least about 1 minute at 200° F. Coatings formed therefrom may comprise a crosslinked reaction product of the amine-terminated polyamide and the resin. The water-soluble fluorescent compound may be compliant with 21 CFR § 175.300 (2019), of which quinine is a representative example. Such coatings that are compliant with 21 CFR § 175.300 may be disposed upon a surface in contact with a foodstuff, such as upon at least a portion of an easy-open end of a can or similar container.

Coating formulations capable of forming coatings exhibiting minimal or no blushing may comprise an aqueous carrier fluid, an amine-terminated polyamide, a resin, an acid catalyst, and a water-soluble fluorescent compound. The resin may comprise at least one compound selected from the group consisting of an aminoplast melamine-based resin, a benzoguanamine-based resin, a cresolformaldehyde-based resin, and any combination thereof. Such coating formulations may be curable in at least about 1 minute at 200° F. Coatings formed therefrom may comprise a crosslinked reaction product of the amine-terminated polyamide and the resin. The water-soluble fluorescent compound may be compliant with 21 CFR § 175.300 (2019), of which quinine is a representative example. Such coatings that are compliant with 21 CFR § 175.300 may be disposed upon a surface in contact with a foodstuff, such as upon at least a portion of an easy-open end of a can or similar container.

A composition contains at least a thermoplastic polyurethane (TPU-1) and a copolyamide (PA-1), prepared by polymerization of at least one lactam and of a monomer mixture (M). The monomer mixture (M) contains at least a C.sub.32-C.sub.40 dimer acid as a component (B1), and at least a C.sub.4-C.sub.12 diamine as a component (B2). A process can be used for preparing such compositions, and the composition can be used for producing shaped articles.

A composition contains at least a thermoplastic polyurethane (TPU-1) and a copolyamide (PA-1), prepared by polymerization of at least one lactam and of a monomer mixture (M). The monomer mixture (M) contains at least a C.sub.32-C.sub.40 dimer acid as a component (B1), and at least a C.sub.4-C.sub.12 diamine as a component (B2). A process can be used for preparing such compositions, and the composition can be used for producing shaped articles.

A composition contains at least a thermoplastic polyurethane (TPU-1) and a copolyamide (PA-1), prepared by polymerization of at least one lactam and of a monomer mixture (M). The monomer mixture (M) contains at least a C.sub.32-C.sub.40 dimer acid as a component (B1), and at least a C.sub.4-C.sub.12 diamine as a component (B2). A process can be used for preparing such compositions, and the composition can be used for producing shaped articles.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.