C08L79/06

MANUFACTURING PROCESS FOR DARK-COLOR POLYMER COMPOSITE FILMS
20220064406 · 2022-03-03 · ·

Provided is a process for producing a polymer composite film, comprising the steps of: (a) mixing a phthalocyanine compound with a polymer or its precursor and a liquid to form a slurry and forming the slurry into a wet film on a solid substrate, wherein the polymer is preferably selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof; and (b) removing the liquid from the wet film and, in some embodiments, converting the precursor to the polymer to form the polymer composite film comprising from 0.1% to 50% by weight of the phthalocyanine compound dispersed in the polymer.

MANUFACTURING PROCESS FOR DARK-COLOR POLYMER COMPOSITE FILMS
20220064406 · 2022-03-03 · ·

Provided is a process for producing a polymer composite film, comprising the steps of: (a) mixing a phthalocyanine compound with a polymer or its precursor and a liquid to form a slurry and forming the slurry into a wet film on a solid substrate, wherein the polymer is preferably selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof; and (b) removing the liquid from the wet film and, in some embodiments, converting the precursor to the polymer to form the polymer composite film comprising from 0.1% to 50% by weight of the phthalocyanine compound dispersed in the polymer.

TRIAZINE-RING-CONTAINING POLYMER AND COMPOSITION INCLUDING SAME

A triazine-ring-containing polymer characterized by including a repeating unit structure represented by formula (1).

##STR00001##

[In the formula, R and R′ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, and Ar represents at least one selected from the group shown by formulas (2) and (3).

##STR00002##

[in the formulas, W.sup.1 and W.sup.2 each independently represent CR.sup.1R.sup.2 (R.sup.1 and R.sup.2 each independently represent a hydrogen atom or a C1-10 alkyl group optionally substituted by a halogen atom (where these together may form a ring)), C═O, S, SO, or SO.sub.2.]]

TRIAZINE-RING-CONTAINING POLYMER AND COMPOSITION INCLUDING SAME

A triazine-ring-containing polymer characterized by including a repeating unit structure represented by formula (1).

##STR00001##

[In the formula, R and R′ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, and Ar represents at least one selected from the group shown by formulas (2) and (3).

##STR00002##

[in the formulas, W.sup.1 and W.sup.2 each independently represent CR.sup.1R.sup.2 (R.sup.1 and R.sup.2 each independently represent a hydrogen atom or a C1-10 alkyl group optionally substituted by a halogen atom (where these together may form a ring)), C═O, S, SO, or SO.sub.2.]]

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD LAMINATE USING THE SAME

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD LAMINATE USING THE SAME

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT COMPRISING CURED FILM, ORGANIC EL DISPLAY DEVICE COMPRISING CURED FILM, METHOD FOR PRODUCING CURED FILM, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE

A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E.sub.2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E.sub.1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

FLOOR COATING COMPOSITION HAVING IMPROVED ADHESION AND METHODS RELATED THERETO
20200317914 · 2020-10-08 · ·

A multi-component composition containing at least one poly(meth)acrylate polyol PA and at least one melamine formaldehyde resin. The multi-component composition further includes at least one catalyst and core-shell particles. The multi-component composition is used in applications related to floor substrate preferably a bowling lane for forming a top coat exhibiting impact resistance, low coefficient of friction and excellent adhesion to the substrate.

FLOOR COATING COMPOSITION HAVING IMPROVED ADHESION AND METHODS RELATED THERETO
20200317914 · 2020-10-08 · ·

A multi-component composition containing at least one poly(meth)acrylate polyol PA and at least one melamine formaldehyde resin. The multi-component composition further includes at least one catalyst and core-shell particles. The multi-component composition is used in applications related to floor substrate preferably a bowling lane for forming a top coat exhibiting impact resistance, low coefficient of friction and excellent adhesion to the substrate.

Method for preparing graphene-polyamide nanocomposite fiber

The present invention discloses a method for preparing graphene-polyamide nanocomposite fiber. The method includes the following steps of: mixing polyamide chips with graphene or modified graphene, and then extruding and palletizing to obtain graphene-polyamide masterbatch; melt-spinning the graphene-polyamide masterbatch after drying the same, to prepare the graphene-polyamide nanocomposite fiber. Compared with the existing industrial polyamide composite fiber, the method of the present invention has the advantages of simple process and low cost, and can effectively improve the production efficiency and capacity; the modified graphene has such an excellent compatibility with the matrix that it can be uniformly dispersed in the matrix, so that the graphene reinforced phase is perfectly compounded with the polyamide matrix material, thereby greatly improving the performance of graphene-polyamide nanocomposite fiber.