The present invention discloses a method for preparing graphene-polyamide nanocomposite fiber. The method includes the following steps of: mixing polyamide chips with graphene or modified graphene, and then extruding and palletizing to obtain graphene-polyamide masterbatch; melt-spinning the graphene-polyamide masterbatch after drying the same, to prepare the graphene-polyamide nanocomposite fiber. Compared with the existing industrial polyamide composite fiber, the method of the present invention has the advantages of simple process and low cost, and can effectively improve the production efficiency and capacity; the modified graphene has such an excellent compatibility with the matrix that it can be uniformly dispersed in the matrix, so that the graphene reinforced phase is perfectly compounded with the polyamide matrix material, thereby greatly improving the performance of graphene-polyamide nanocomposite fiber.

A cellulose-fiber-dispersing polyolefin resin composite material, containing a polyolefin resin and a cellulose fiber dispersed in the polyolefin resin, in which the composite material contains the cellulose fiber of 3 mass % or more and less than 70 mass %, and when the composite material is subjected to the abrasion test according to ISO 6722 under the following test conditions, the amount of abrasion after 5,000 reciprocations satisfies the [Formula 1]: (Amount of abrasion [mm] of the cellulose-fiber-dispersing polyolefin resin composite material)<0.003(Cellulose effective mass ratio of the cellulose-fiber-dispersing polyolefin resin composite material)+0.3,

[Test Conditions for Abrasion Test]

Load: 1.7 kg, Needle diameter: 0.45 mm, Stroke length: 10 mm, Period: 60 reciprocations/min, Test piece: length 38 mmwidth 6 mmthickness 1 mm, Temperature: 23 C.

A cellulose-fiber-dispersing polyolefin resin composite material, containing a polyolefin resin and a cellulose fiber dispersed in the polyolefin resin, in which the composite material contains the cellulose fiber of 3 mass % or more and less than 70 mass %, and when the composite material is subjected to the abrasion test according to ISO 6722 under the following test conditions, the amount of abrasion after 5,000 reciprocations satisfies the [Formula 1]: (Amount of abrasion [mm] of the cellulose-fiber-dispersing polyolefin resin composite material)<0.003(Cellulose effective mass ratio of the cellulose-fiber-dispersing polyolefin resin composite material)+0.3,

[Test Conditions for Abrasion Test]

Load: 1.7 kg, Needle diameter: 0.45 mm, Stroke length: 10 mm, Period: 60 reciprocations/min, Test piece: length 38 mmwidth 6 mmthickness 1 mm, Temperature: 23 C.

A positive photosensitive resin composition, a photosensitive resin layer, and an electronic device, the composition including an alkali soluble resin; a photosensitive diazoquinone compound; a dissolution controlling agent represented by Chemical Formula 1; a cross-linking agent represented by Chemical Formula 2; and a solvent, wherein the dissolution controlling agent and the cross-linking agent are included in a weight ratio of about 1:1 to about 1:2:

##STR00001##

A positive photosensitive resin composition, a photosensitive resin layer, and an electronic device, the composition including an alkali soluble resin; a photosensitive diazoquinone compound; a dissolution controlling agent represented by Chemical Formula 1; a cross-linking agent represented by Chemical Formula 2; and a solvent, wherein the dissolution controlling agent and the cross-linking agent are included in a weight ratio of about 1:1 to about 1:2:

##STR00001##

There are provided a curable resin composition capable of having a rapid curing property and forming a cured product with an excellent property such as a high heat resistance, a cured product obtained from the curable resin composition, and a method for hardening the curable resin composition. There is further provided a semiconductor device using the curable resin composition as a sealant. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and optionally further contains (E) an inorganic filler. The semiconductor device contains a cured product obtained by hardening the curable resin composition containing the components (A) to (E), and further contains a semiconductor element placed in the cured product.

There are provided a curable resin composition capable of having a rapid curing property and forming a cured product with an excellent property such as a high heat resistance, a cured product obtained from the curable resin composition, and a method for hardening the curable resin composition. There is further provided a semiconductor device using the curable resin composition as a sealant. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings, (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a phosphorus-containing curing accelerator, and optionally further contains (E) an inorganic filler. The semiconductor device contains a cured product obtained by hardening the curable resin composition containing the components (A) to (E), and further contains a semiconductor element placed in the cured product.

Provided is a process for producing a polymer composite film, comprising the steps of: (a) mixing a phthalocyanine compound with a polymer or its precursor and a liquid to form a slurry and forming the slurry into a wet film on a solid substrate, wherein the polymer is preferably selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof; and (b) removing the liquid from the wet film and, in some embodiments, converting the precursor to the polymer to form the polymer composite film comprising from 0.1% to 50% by weight of the phthalocyanine compound dispersed in the polymer.

Provided is a process for producing a polymer composite film, comprising the steps of: (a) mixing a phthalocyanine compound with a polymer or its precursor and a liquid to form a slurry and forming the slurry into a wet film on a solid substrate, wherein the polymer is preferably selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof; and (b) removing the liquid from the wet film and, in some embodiments, converting the precursor to the polymer to form the polymer composite film comprising from 0.1% to 50% by weight of the phthalocyanine compound dispersed in the polymer.

A black-color polymer composite film comprising a phthalocyanine compound dispersed in a polymer selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof, wherein the phthalocyanine compound occupies a weight fraction of 0.1% to 50% based on the total polymer composite weight. Preferably, the phthalocyanine compound is selected from copper phthalocyanine, zinc phthalocyanine, tin phthalocyanine, iron phthalocyanine, lead phthalocyanine, nickel phthalocyanine, vanadyl phthalocyanine, fluorochromium phthalocyanine, magnesium phthalocyanine, manganous phthalocyanine, dilithium phthalocyanine, aluminum phthalocyanine chloride, cadmium phthalocyanine, chlorogallium phthalocyanine, cobalt phthalocyanine, silver phthalocyanine, a metal-free phthalocyanine, or a combination thereof.