The present invention relates to a water-based coating composition, the preparation and use of the composition, a two-component coating system comprising the composition and use thereof, and an article obtained by coating with the composition or the two-component coating system. The water-based coating composition comprises a water-based UV resin; a silane-treated nanosized silicon oxide compound; and a photoinitiator; wherein per kilogram of the solid constituent of the water-based UV resin contains not less than 3 mol of ethylenically unsaturated groups, and wherein the weight ratio of the solid constituent of the nanosized silicon oxide compound to the solid constituent of the water-based UV resin is 11:20 to 73:100. The coating layer formed by the water-based coating composition of the present invention has high hardness and good adhesion, and is particularly suitable for electronic, electrical and communication equipment in the 5G field.

The present invention relates to a water-based coating composition, the preparation and use of the composition, a two-component coating system comprising the composition and use thereof, and an article obtained by coating with the composition or the two-component coating system. The water-based coating composition comprises a water-based UV resin; a silane-treated nanosized silicon oxide compound; and a photoinitiator; wherein per kilogram of the solid constituent of the water-based UV resin contains not less than 3 mol of ethylenically unsaturated groups, and wherein the weight ratio of the solid constituent of the nanosized silicon oxide compound to the solid constituent of the water-based UV resin is 11:20 to 73:100. The coating layer formed by the water-based coating composition of the present invention has high hardness and good adhesion, and is particularly suitable for electronic, electrical and communication equipment in the 5G field.

A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

To provide an optical film having excellent visibility in the wide angle direction. An optical film including at least one resin selected from the group consisting of a polyimide-based resin and a polyamide-based resin, wherein the optical film satisfies Formula (1):
0≤Ts≤0.35  (1)
wherein Ts represents a scattered light ratio (%) and is defined as Ts=Td/Tt×100, Td and Tt represent a diffuse light transmittance (%) and a total light transmittance (%), measured in accordance with JIS K-7136, respectively.

To provide an optical film having excellent visibility in the wide angle direction. An optical film including at least one resin selected from the group consisting of a polyimide-based resin and a polyamide-based resin, wherein the optical film satisfies Formula (1):
0≤Ts≤0.35  (1)
wherein Ts represents a scattered light ratio (%) and is defined as Ts=Td/Tt×100, Td and Tt represent a diffuse light transmittance (%) and a total light transmittance (%), measured in accordance with JIS K-7136, respectively.

To provide an optical film having excellent visibility in the wide angle direction. An optical film including at least one resin selected from the group consisting of a polyimide-based resin and a polyamide-based resin, wherein the optical film satisfies Formula (1):
0≤Ts≤0.35  (1)
wherein Ts represents a scattered light ratio (%) and is defined as Ts=Td/Tt×100, Td and Tt represent a diffuse light transmittance (%) and a total light transmittance (%), measured in accordance with JIS K-7136, respectively.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.