C08L83/06

CURABLE ORGANOSILICON RESIN COMPOSITION

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

CURABLE ORGANOSILICON RESIN COMPOSITION

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

CURABLE ORGANOSILICON RESIN COMPOSITION

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

High refractive index, high Abbe compositions

Disclosed are hydrophobic, acrylic materials having both high refractive index and a high Abbe number. The materials may have an internal wetting agent, are well suited for use as implantable ophthalmic devices, and have a refractive index which may be edited through application of energy. When used for an intraocular lens, the high refractive index allows for a thin lens which compresses to allow a small incision size.

High refractive index, high Abbe compositions

Disclosed are hydrophobic, acrylic materials having both high refractive index and a high Abbe number. The materials may have an internal wetting agent, are well suited for use as implantable ophthalmic devices, and have a refractive index which may be edited through application of energy. When used for an intraocular lens, the high refractive index allows for a thin lens which compresses to allow a small incision size.

CROSS-LINKABLE COMPOSITIONS BASED ON ORGANOSILICON COMPOUNDS
20230235174 · 2023-07-27 · ·

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).

CROSS-LINKABLE COMPOSITIONS BASED ON ORGANOSILICON COMPOUNDS
20230235174 · 2023-07-27 · ·

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).

Optical laminate and image display device including the same

An optical laminate includes two substrates each of which has a tensile modulus in a range from 2,000 MPa to 7,500 MPa, and an adhesive layer interposed between the substrates. A storage modulus at 25° C. of the adhesive layer is 100 kPa or less, and a storage modulus at −20° C. of the adhesive layer is equal to or less than three times the storage modulus at 25° C. of the adhesive layer. The optical laminate and an image display device including the optical laminate may have an improved flexible property at various temperature ranges and may be capable of minimizing cracks when being bent.

Optical laminate and image display device including the same

An optical laminate includes two substrates each of which has a tensile modulus in a range from 2,000 MPa to 7,500 MPa, and an adhesive layer interposed between the substrates. A storage modulus at 25° C. of the adhesive layer is 100 kPa or less, and a storage modulus at −20° C. of the adhesive layer is equal to or less than three times the storage modulus at 25° C. of the adhesive layer. The optical laminate and an image display device including the optical laminate may have an improved flexible property at various temperature ranges and may be capable of minimizing cracks when being bent.

SEALANT COMPOSITION
20230024520 · 2023-01-26 ·

A one-part room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a silicone elastomer which may be used as a clear sealant which avoids discolouration and loss of adhesion upon aging.