The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

A polymeric composition includes an ethylene polymer, 0.05 wt % to 0.25 wt % carbon black based on a total weight of the polymeric composition and a polymeric ultraviolet light stabilizer including a hindered amine moiety and having a weight average molecular weight from 5,000 g/mol to 20,000 g/mol as measured according to Gel Permeation Chromatography.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The present invention relates to a photovoltaic module comprising a protective front layer element, an encapsulation layer element, a photovoltaic cell element and a protective back layer element, whereby at least one of theprotective elements comprises glass; wherein the encapsulation layer element comprises a polymer composition (I) comprising at least the following components: (A) 90 to 99.8 wt.-% based on the overall weight of the polymer composition (I) of a polymer selected from a polyolefin elastomer or a polymer of ethylene (a) selected from (a1) a copolymer of ethylene which bears functional groups containing units; (a2) a copolymerof ethylene comprising one or more polar comonomer unit(s) selected from (C1-C6)-alkyl acrylate or (C1-C6)-alkyl (C1-C6)-alkyl acrylate comonomer units, and optionally bears functional groups containing units different from said polar comonomer unit(s); (a3) a copolymer of ethylene comprising one or more alpha-olefin comonomer unit(s); and optionally bears functional groups containing units different fromsaid polar comonomer unit(s) of polymer (a2); or mixtures thereof; and (b) silane group(s) containing units; (B) 0.2 to 10 wt.-% based on the overall weight of the polymer composition (I) of a copolymer of ethylene, which bears functional group containing units originating from at least one unsaturated carboxylic acid and/or its anhydrides, metal salts, esters, amides or imidesand mixtures thereof, whereby component (B) is different from component (A) Furthermore, the present invention refers to the use of an encapsulation layer element comprising polymer composition (I) according to the invention for increasing the Pmax determined after 96 h according to IEC 60904, by applying the foil method with a temperature of 85° C. and relative humidity of 60% and a potential differenceof 1500 V, of a photovoltaic module comprising besides the encapsulation layer element a protective front layer element, a photovoltaic cell element and a protective back element, whereby at least one of the protective elements comprises glass.

A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer can have a transmittance of 90% or higher in the visible range and a storage modulus at 25° C. of 1×10.sup.7 Pa or less. The cured resin layer can be formed from a resin composition that has a cure shrinkage of 5% or less.

A room temperature curable organopolysiloxane composition comprises: (A) an organopolysiloxane having alkoxysilyl-containing groups at both molecular terminals; (B) an organopolysiloxane resin; (C) an alkoxysilane; and (D) a condensation-reaction catalyst. The room temperature curable organopolysiloxane composition exhibits good to excellent storage stability. In addition, the room temperature curable organopolysiloxane composition can form a cured product exhibiting good to excellent mechanical properties.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

An object of the present invention is to provide a photocurable resin composition having a high curing degree after irradiation with light while maintaining cured material characteristics such as high extensibility and high strength. Provided is a photocurable resin composition including the following ingredients (A) to (C): ingredient (A): a polyisobutylene resin containing one or more (meth)acryloyl groups and a —[CH.sub.2C(CH.sub.3).sub.2]— unit; ingredient (B): ingredient (b1): an acrylate monomer having an alicyclic hydrocarbon group having 5 to 25 carbon atoms, and ingredient (b2): an acrylate monomer having a linear or branched alkyl group having 11 to 30 carbon atoms; and ingredient (C): a photo-radical polymerization initiator.

A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

Polymeric compositions comprising a polybutylene terephthalate; a low-density polyolefin selected from a low-density polyethylene, a polyolefin elastomer, or combinations thereof; and a maleated ethylene-based polymer. Optical cable components fabricated from the polymeric composition. Optionally, the polymeric composition can further comprise one or more additives, such as a filler. The optical fiber cable components can be selected from buffer tubes, core tubes, and slotted core tubes, among others.