A curable composition comprising a polymer A, a polymer B, and one or more fillers, wherein the polymer A includes organic molecules or siloxane molecules comprising two or more epoxy functional groups, and the polymer B includes an organic amine or a hybrid silicone amine.

The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.

The present application relates to an encapsulant for a PV module, a method of manufacturing the same and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep physical properties, and thus even when the encapsulant is used under conditions of a high temperature and/or high humidity for a long time, deformation is small and the encapsulant can exhibit excellent adhesive strength. Accordingly, when the encapsulant is applied to a PV module, durability or the like may be improved.

A waterproof component may be an insert molded body formed from a thermoplastic resin composition and a metal component. The thermoplastic resin composition may contain a thermoplastic resin (A), an inorganic reinforcement (B), and a polyolefin (C1) or a long-chain fatty acid-based compound (C2). The content of the inorganic reinforcement (B) may be in a range of from 8 to 130 parts by mass, and the content of the polyolefin (C1) or the long-chain fatty acid-based compound (C2) may be in a range of from 1.0 to 40 parts by mass, based on 100 parts by mass of the thermoplastic resin (A). An electronic device may be provided with the same.

An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:

E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-E2  Formula 1

E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-(L5).sub.b5-A-(L6).sub.b6-(M4).sub.a3-(L3).sub.b3-M6-(L4).sub.b4-(M5).sub.a4-E2  Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.

An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hydroxy group; B: having at least two carboxy groups; and C: having a structure in which two carboxy groups are condensed by dehydration.

An adhesive having water vapour barrier properties, comprising an adhesive base composed of at least one reactive resin, at least one elastomer and optionally at least one tackifying resin, and optionally a solvent, is particularly suitable as a barrier adhesive when it comprises at least one multifunctional oligomeric alkoxysiloxane, said oligomeric alkoxysiloxane containing more than one polymerizable group and more than one alkoxy group.

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

Disclosed is a polyamide-ionomer composition suitable for use in a backsheet in a photovoltaic module comprising a polymer component comprising a polyamide and an ionomer comprising a copolymer of ethylene, an alpha, beta-unsaturated C.sub.3-C.sub.8 carboxylic acid, wherein the carboxylic acid functionalities present are at least partially neutralized to carboxylate salts of one or more alkali metal, transition metal, or alkaline earth metal cations; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; wherein the combination of pigment and filler comprises 8 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.

Disclosed is a polyamide-ionomer composition suitable for use in a backsheet in a photovoltaic module comprising a polymer component a polyamide and an anhydride ionomer comprising a copolymer of ethylene, an alpha, beta-unsaturated C.sub.3-C.sub.8 carboxylic acid and an ethylenically unsaturated dicarboxylic acid or derivative thereof selected from the group consisting of maleic acid, fumaric acid, itaconic acid, maleic anhydride, and a C.sub.1-C.sub.1 alkyl half ester of maleic acid, wherein the carboxylic acid functionalities present are at least partially neutralized to carboxylate salts of one or more alkali metal, transition metal, or alkaline earth metal cations; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; preferably wherein the combination of pigment and filler comprises 10 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.