There is disclosed a lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed radially outward of at least one of a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal.

A solid composite material combining: an inorganic pigment in the form of discrete particles each comprising a colored core and a coating adapted to allow light to pass through and a matrix based on metalloid or metal oxide, said matrix being adapted to allow light to pass through.

Described herein are paint primer additives and paint primer formulations thereof. The paint primer formulations and paint primer additive described herein can be applied to surface or portion thereof. The paint primer additive and/or paint primer formulations described herein can be effective to block or reduce transmission of electromagnetic radiation through a surface.

A resin-coated metal powder according to the present invention is obtained by covering at least a part of the surface of a metal powder with a hydrolyzable resin that has an average composition of general formula (1) and a number average molecular weight of from 500 to 100,000; and this resin-coated metal powder exhibits sufficient dispersibility in an aqueous solution, while being stable for a relatively long period of time even in the coexistence of water in an aqueous coating material.

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(In the formula, R.sup.1 represents a linear or branched monovalent hydrocarbon group having from 1 to 10 carbon atoms, said group optionally having a specific substituent such as a hydroxyalkyl group; each of R.sup.3, R.sup.4 and R.sup.5 independently represents a linear or branched monovalent hydrocarbon group having from 1 to 10 carbon atoms; each of R.sup.2 and R.sup.6 independently represents a hydrogen atom or a linear or branched monovalent hydrocarbon group having from 1 to 10 carbon atoms; and a and b represent numbers that satisfy 0a<1, 0<b1 and (a+b)=1.)

A particle including a core particle; and a vapor deposited colorant including an organic colored material that encapsulates the core particle. The particle can be a special effect pigment or a thin film interference pigment. Methods of making the particle are also disclosed.

A copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass % of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass % of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20 C.; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20 C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.

A particle including a core particle; and a vapor deposited colorant including an organic colored material that encapsulates the core particle. The particle can be a special effect pigment or a thin film interference pigment. Methods of making the particle are also disclosed.

Provided is a copper paste containing a copper powder and an organic solvent, wherein the organic solvent is an alcohol-based solvent containing one or more first alcohols selected from the group consisting of monohydric and dihydric alcohols having a viscosity at 20? C. of 30-70 mPa.Math.s, and one or more second alcohols selected from the group consisting of dihydric and trihydric alcohols having a viscosity at 20? C. of 300-1000 mPa.Math.s.

To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass % of copper and/or copper oxide microparticies and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass % of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20 C.; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20 C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.

The present invention involves pigments derived from compounds with the LiSbO.sub.3-type or LiNbO.sub.3-type structures. These compounds possess the following formulations M.sup.1M.sup.5Z.sub.3, M.sup.1M.sup.2M.sup.4M.sup.5Z.sub.6, M.sup.1M.sup.3.sub.2M.sup.5Z.sub.6, M.sup.1M.sup.2M.sup.3M.sup.6Z.sub.6, M.sup.1.sub.2M.sup.4M.sup.6Z.sub.6, M.sup.1M.sup.5M.sup.6Z.sub.6, or a combination thereof. The cation M.sup.1 represents an element with a valence of +1 or a mixture thereof, the cation M.sup.2 represents an element with a valence of +2 or a mixture thereof, the cation M.sup.3 represents an element with a valence of +3 or a mixture thereof, the cation M.sup.4 represents an element with a valence of +4 or a mixture thereof, the cation M.sup.5 represents an element with a valence of +5 or a mixture thereof, and the cation M.sup.6 represents an element with a valence of +6 or a mixture thereof. The cation M is selected from H, Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ru, Co, Ni, Cu, Ag, Zn, B, Al, Ga, In, Si, Ge, Sn, P, Sb, or Te. The anion Z is selected from N, O, S, Se, Cl, F, hydroxide ion or a mixture thereof. Along with the elements mentioned above vacancies may also reside on the M or Z sites of the above formulations such that the structural type is retained. The above formula may also include M dopant additions below 20 atomic %, where the dopant is selected from H, Li, Na, K, Rb, Cs, Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ru, Co, Ni, Cu, Ag, Zn, B, Al, Ga, In, Si, Ge, Sn, P, Sb, Bi, Te, or mixtures thereof.