C09D7/41

Coating compositions for application utilizing a high transfer efficiency applicator and methods and systems thereof

A system for applying a coating composition to a substrate utilizing a high transfer efficiency applicator is provided herein. The system includes a storage device for storing instructions for performing a matching protocol, and one or more data processors configured to execute the instructions to, receive, by one or more data processors, target image data of a target coating, the target image data generated by an electronic imaging device, and apply the target image data to a matching protocol to generate application instructions. The system further includes a high transfer efficiency applicator defining a nozzle orifice. The high transfer efficiency applicator is configured to expel the coating composition through the nozzle orifice to the substrate to form a coating layer. The high transfer efficiency applicator is configured expel the coating composition based on the application instructions.

Coating compositions for application utilizing a high transfer efficiency applicator and methods and systems thereof

A system for applying a coating composition to a substrate utilizing a high transfer efficiency applicator is provided herein. The system includes a storage device for storing instructions for performing a matching protocol, and one or more data processors configured to execute the instructions to, receive, by one or more data processors, target image data of a target coating, the target image data generated by an electronic imaging device, and apply the target image data to a matching protocol to generate application instructions. The system further includes a high transfer efficiency applicator defining a nozzle orifice. The high transfer efficiency applicator is configured to expel the coating composition through the nozzle orifice to the substrate to form a coating layer. The high transfer efficiency applicator is configured expel the coating composition based on the application instructions.

Optical structure, camera module, and electronic device

Disclosed are an optical structure, and a camera module and an electronic device including the same. The optical structure includes a transparent substrate; a first moisture-proof layer disposed on the transparent substrate and including a first organic material having moisture-proof properties; and a first near-infrared absorbing layer disposed between the transparent substrate and the first moisture-proof layer and including a copper complex, wherein the first organic material having moisture-proof properties has a water vapor transmission rate (WVTR) of less than or equal to about 100 g/m.sup.2/day measured at a thickness of 100 μm.

Optical structure, camera module, and electronic device

Disclosed are an optical structure, and a camera module and an electronic device including the same. The optical structure includes a transparent substrate; a first moisture-proof layer disposed on the transparent substrate and including a first organic material having moisture-proof properties; and a first near-infrared absorbing layer disposed between the transparent substrate and the first moisture-proof layer and including a copper complex, wherein the first organic material having moisture-proof properties has a water vapor transmission rate (WVTR) of less than or equal to about 100 g/m.sup.2/day measured at a thickness of 100 μm.

PHYCOCYANIN PIGMENT COMPOSITION

An object of the present invention is to provide a phycocyanin pigment composition insoluble in water and provide food, cosmetics, a coating material or a printing marker for pharmaceuticals or agricultural chemicals, a stationery product, a writing tool, a printing ink, an inkjet ink, a metal ink, a paint, a plastic coloring agent, a color toner, a fluorescent labeling agent, a fluorescent probe, or a chemical sensor, each containing the pigment composition. It was found that the phycocyanin pigment composition containing phycocyanin and a metal or a metal compound was insoluble in water, and thus the present invention was accomplished.

ADDITIVE MANUFACTURING COMPOSITIONS AND METHODS INCLUDING RESIN STABILIZED PIGMENTS

Additive manufacturing compositions and methods may include a resin stabilized pigment. The pigment may be easily combined with at least one component of a co-reactive system, such as a co-reactive prepolymer formulation, via solid mixing without the need for grinding or additional solvents. The prepolymer formulation may be pigmented, printed, and cured under ambient conditions, and one or more pigments may be incorporated into the composition to change the color of the composition during printing and/or to selectively change the color of the printed article among several colors.

PAINT COMPOSITIONS WITH COLOR CHANGE CHARACTERISTICS

A paint composition includes a fluid and a coloring agent in the fluid. The fluid maintains the coloring agent in a first protonation state. The coloring agent exhibits a first color characteristic in the first protonation state. The paint composition includes microcapsules in the fluid. The paint composition also includes a chemical compound in the microcapsules. Rupture of at least a portion of the microcapsules is configured to release the chemical compound and expose the coloring agent to the chemical compound. Exposure of the coloring agent to the chemical compound changes the coloring agent from the first protonation state with the first color characteristic to a second protonation state with a second color characteristic. The second color characteristic is visually distinct from the first color characteristic.

Composition for Preparation of Plating Base and Plating Base Thereof
20170356089 · 2017-12-14 ·

Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION OF SOLVENT FREE TYPE

Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent: (A) silicone-modified polyimide resin; (B) polymerizable compound; (C) polymerization initiator, (D) hydrophobic fumed silica; and (E) adhesion auxiliary agent.

ELECTRONIC DEVICE COVERS WITH DYEING LAYERS

The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.