Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).

##STR00001##

Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).

##STR00001##

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

The present invention relates to a novel styrenic polymer comprised of the repeat units of structures (I), (II), and (III), wherein R.sub.1, R.sub.2 and R.sub.3 are individually selected from H or a C-1 to C-4 linear alkyl, R.sub.5, R.sub.7 and R.sub.6 are individually selected from a C-1 to C-8 linear alkyl, a C-3 to C-8 linear alkyl and a C-3 to C-8 cyclic alkyl and to the novel composition comprised of this polymer and a spin on organic solvent. In another aspect of this invention it pertains to the use of this composition to create a grafted on a substrate, and a further aspect, this grafted film may be used in a directed self-assembly process.

##STR00001##

A method of producing a substrate includes: applying a composition on a metal basal plate to form a coating film; and forming a metal-containing layer on at least a part of the coating film. The composition contains a solvent, and a polymer having a first terminal structure and a second terminal structure in a single molecule. Each of the first terminal structure and the second terminal structure is at least one selected from the group consisting of a structure represented by formula (1) and a structure represented by formula (2). A.sup.1 and A.sup.2 each independently represent a monovalent group having a functional group capable of forming a chemical bond with a metal atom. L.sup.2 represents —S—, —NR—, or —NA.sup.22-, wherein A.sup.22 represents a monovalent group having a functional group capable of forming a chemical bond with a metal atom.

##STR00001##

Described herein is a multi-phase polymer binder including an aqueous polymer dispersion, an optional hydrophobic emulsion, and an optional surfactant. The polymer binder, when dried, provides a water uptake of less than about 5 g/m.sup.2/20 min, a seal strength of at least about 200 Newton/meter (N/m) as measured at 25 C. or at 90 C., and sufficient block resistance to impart no substrate damage.

Described herein is a multi-phase polymer binder including an aqueous polymer dispersion, an optional hydrophobic emulsion, and an optional surfactant. The polymer binder, when dried, provides a water uptake of less than about 5 g/m.sup.2/20 min, a seal strength of at least about 200 Newton/meter (N/m) as measured at 25 C. or at 90 C., and sufficient block resistance to impart no substrate damage.

Described herein is a multi-phase polymer binder including an aqueous polymer dispersion, an optional hydrophobic emulsion, and an optional surfactant. The polymer binder, when dried, provides a water uptake of less than about 5 g/m.sup.2/20 min, a seal strength of at least about 200 Newton/meter (N/m) as measured at 25 C. or at 90 C., and sufficient block resistance to impart no substrate damage.

Described herein is a multi-phase polymer binder including an aqueous polymer dispersion, an optional hydrophobic emulsion, and an optional surfactant. The polymer binder, when dried, provides a water uptake of less than about 5 g/m.sup.2/20 min, a seal strength of at least about 200 Newton/meter (N/m) as measured at 25 C. or at 90 C., and sufficient block resistance to impart no substrate damage.