Patent classifications
C09D161/16
Insulated wire and preparation method thereof, coil and electronic/electrical device
Example implementations include an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. A bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed.
Method for Solid Freeform Fabrication
The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. The deposited powder bed is heated to about 50 C. to about 170 C. Then, a solution of activating agent is printed on the powder bed in a predetermined pattern, and a stimulus is applied converting the prepolymer to the final polymer. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.
Method for Solid Freeform Fabrication
The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. The deposited powder bed is heated to about 50 C. to about 170 C. Then, a solution of activating agent is printed on the powder bed in a predetermined pattern, and a stimulus is applied converting the prepolymer to the final polymer. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.
Resist underlayer film-forming composition
The present invention provides a novel resist underlayer film-forming composition capable of forming a resist underlayer film that has etching resistance and excellent embeddability in a surface having concave portions and/or convex portions. A resist underlayer film-forming composition comprising a polymer having a structural unit represented by formula (1) or formula (2): ##STR00001##
(wherein X is an arylene group, n is 1 or 2, and R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are each independently a hydrogen atom, a hydroxy group, a C.sub.1-3 alkyl group, or a phenyl group), and a solvent.
Resist underlayer film-forming composition
The present invention provides a novel resist underlayer film-forming composition capable of forming a resist underlayer film that has etching resistance and excellent embeddability in a surface having concave portions and/or convex portions. A resist underlayer film-forming composition comprising a polymer having a structural unit represented by formula (1) or formula (2): ##STR00001##
(wherein X is an arylene group, n is 1 or 2, and R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are each independently a hydrogen atom, a hydroxy group, a C.sub.1-3 alkyl group, or a phenyl group), and a solvent.
AMORPHOUS POLYARYLETHERKETONE AND BLENDS THEREOF FOR USE IN ADDITIVE MANUFACTURING
A material for use with a 3D printer comprises a polyaryletherketone (PAEK) having an amorphous morphology. In some embodiments, the material also includes one or more further compounds having an amorphous morphology. In some further embodiments, the material includes, in addition to an amorphous PAEK, a compound having a semi-crystalline morphology.
AMORPHOUS POLYARYLETHERKETONE AND BLENDS THEREOF FOR USE IN ADDITIVE MANUFACTURING
A material for use with a 3D printer comprises a polyaryletherketone (PAEK) having an amorphous morphology. In some embodiments, the material also includes one or more further compounds having an amorphous morphology. In some further embodiments, the material includes, in addition to an amorphous PAEK, a compound having a semi-crystalline morphology.
Method for solid freeform fabrication
The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. The deposited powder bed is heated to about 50 C. to about 170 C. Then, a solution of activating agent is printed on the powder bed in a predetermined pattern, and a stimulus is applied converting the prepolymer to the final polymer. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.
Method for solid freeform fabrication
The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. The deposited powder bed is heated to about 50 C. to about 170 C. Then, a solution of activating agent is printed on the powder bed in a predetermined pattern, and a stimulus is applied converting the prepolymer to the final polymer. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.
HEATING ELEMENT COMPOSITION CAPABLE OF THREE-DIMENSIONAL MOLDING, AND FILM HEATER FORMED THEREFROM
The present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom. Specifically, the present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom, wherein the heating element composition has high extensibility and excellent high temperature durability which is in a conflicting relationship with extensibility, so that mechanical damage such as cracks during stretching can be suppressed, has the characteristic of being stably maintained in a molded shape rather than being restored to an original shape after molding, like conventional stretchable materials, can minimize the change rate of resistance when deformed by three-dimensional molding, can be cured at 150 C. or less, and can form a heating element by various printings or coatings so as to be applied to various film heaters.