Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.

A resist underlayer film-forming composition including a novolac resin having a structural group (C) formed by reaction between an aromatic ring of an aromatic compound (A) having at least two amino groups and three C.sub.6-40 aromatic rings and a vinyl group of an aromatic vinyl compound (B). The structural group (C) may be a group of the following Formula (1):

##STR00001##

[wherein R.sup.1 is a divalent group containing at least two amino groups and at least three C.sub.6-40 aromatic rings]. R.sup.1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of a compound of the following Formula (2):

##STR00002##

R.sup.1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of N,N-diphenyl-1,4-phenylenediamine.

A resist underlayer film-forming composition includes a resin; and a crosslinkable compound of Formula (1) or Formula (2):

##STR00001##

wherein the crosslinkable compound of Formula (1) or Formula (2) is a compound obtained by reacting a compound of Formula (3) or Formula (4):

##STR00002##

with an ether compound comprising a hydroxy group or a C.sub.2-10 alcohol.

A resist underlayer film-forming composition includes a resin; and a crosslinkable compound of Formula (1) or Formula (2):

##STR00001##

wherein the crosslinkable compound of Formula (1) or Formula (2) is a compound obtained by reacting a compound of Formula (3) or Formula (4):

##STR00002##

with an ether compound comprising a hydroxy group or a C.sub.2-10 alcohol.

A resist underlayer film-forming composition includes a resin; and a crosslinkable compound of Formula (1) or Formula (2):

##STR00001##

wherein the crosslinkable compound of Formula (1) or Formula (2) is a compound obtained by reacting a compound of Formula (3) or Formula (4):

##STR00002##

with an ether compound comprising a hydroxy group or a C.sub.2-10 alcohol.

A resist underlayer film for use in lithography process which generates less sublimate, has excellent embeddability at the time of applying onto a substrate having a hole pattern, and has high dry etching resistance, wiggling resistance and heat resistance, etc. A resist underlayer film-forming composition including a resin and a crosslinkable compound of Formula (1) or Formula (2): ##STR00001##
in which Q.sup.1 is a single bond or an m1-valent organic group, R.sup.1 and R.sup.4 are each a C.sub.2-10 alkyl group or a C.sub.2-10 alkyl group having a C.sub.1-10 alkoxy group, R.sup.2 and R.sup.5 are each a hydrogen atom or a methyl group, R.sup.3 and R.sup.6 are each a C.sub.1-10 alkyl group or a C.sub.6-40 aryl group.

A resist underlayer film for use in lithography process which generates less sublimate, has excellent embeddability at the time of applying onto a substrate having a hole pattern, and has high dry etching resistance, wiggling resistance and heat resistance, etc. A resist underlayer film-forming composition including a resin and a crosslinkable compound of Formula (1) or Formula (2): ##STR00001##
in which Q.sup.1 is a single bond or an m1-valent organic group, R.sup.1 and R.sup.4 are each a C.sub.2-10 alkyl group or a C.sub.2-10 alkyl group having a C.sub.1-10 alkoxy group, R.sup.2 and R.sup.5 are each a hydrogen atom or a methyl group, R.sup.3 and R.sup.6 are each a C.sub.1-10 alkyl group or a C.sub.6-40 aryl group.

A resist underlayer film for use in lithography process which generates less sublimate, has excellent embeddability at the time of applying onto a substrate having a hole pattern, and has high dry etching resistance, wiggling resistance and heat resistance, etc. A resist underlayer film-forming composition including a resin and a crosslinkable compound of Formula (1) or Formula (2): ##STR00001##
in which Q.sup.1 is a single bond or an m1-valent organic group, R.sup.1 and R.sup.4 are each a C.sub.2-10 alkyl group or a C.sub.2-10 alkyl group having a C.sub.1-10 alkoxy group, R.sup.2 and R.sup.5 are each a hydrogen atom or a methyl group, R.sup.3 and R.sup.6 are each a C.sub.1-10 alkyl group or a C.sub.6-40 aryl group.

Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.

Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.