Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.

Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.

Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.

Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.

A resist underlayer film-forming composition exhibiting high etching resistance, high heat resistance, and excellent coatability; a resist underlayer film obtained using the resist underlayer film-forming composition and a method for producing the same; a method for forming a resist pattern; and a method for producing a semiconductor device. A resist underlayer film-forming composition including a polymer and a compound represented by Formula (1) as a solvent.

##STR00001##

In Formula (1), R.sup.1, R.sup.2, and R.sup.3 in Formula (1) each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, which may be interrupted by an oxygen atom, a sulfur atom, or an amide bond, and R.sup.1, R.sup.2, and R.sup.3 may be the same or different and may bond to each other to form a ring structure.

A method for manufacturing a semiconductor substrate having a patterned group-III nitride compound layer without collapsing a formed mask pattern due to reflow or decomposition even when an etching method at a high temperature of 300? C.-700? C. is used, including the steps: forming a patterned mask layer on the substrate's group-III nitride compound layer, and etching the group-III nitride compound layer by dry etching at 300? C. or higher and 700? C. or lower using the mask pattern, to form patterned group-III nitride compound layer, wherein the patterned mask layer contains a polymer containing a unit structure of the following Formula (1):

##STR00001##

a polymer containing a unit structure of the following Formula (2):

?OAr.sub.1?Formula (2)

a polymer containing a structural unit of the following Formula (3):

?OAr.sub.2OAr.sub.3-T-Ar.sub.4?Formula (3)

a polymer containing a combination of unit structure of Formula (2) and unit structure of Formula (3), or a crosslinked structure of the polymers.

A material to form a resist underlayer film having properties achieving heat resistance, flattening properties, and etching resistance through lithography. A resist underlayer film forming composition including a polymer having a unit structure of Formula (1):

##STR00001##

(wherein R.sup.1 is an organic group having at least two amines and at least three C.sub.6-40 aromatic rings, R.sup.2 and R.sup.3 are each a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-40 aryl group, a heterocyclic group, or a combination thereof, and the alkyl group, the aryl group, and the heterocyclic group are optionally substituted with a halogen group, a nitro group, an amino group, a formyl group, an alkoxy group, or a hydroxy group, or R.sup.2 and R.sup.3 optionally form a ring together). The above mentioned composition t, wherein R.sup.1 is a divalent organic group derived from N,N-diphenyl-1,4-phenylenediamine.

A material to form a resist underlayer film having properties achieving heat resistance, flattening properties, and etching resistance through lithography. A resist underlayer film forming composition including a polymer having a unit structure of Formula (1):

##STR00001##

(wherein R.sup.1 is an organic group having at least two amines and at least three C.sub.6-40 aromatic rings, R.sup.2 and R.sup.3 are each a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-40 aryl group, a heterocyclic group, or a combination thereof, and the alkyl group, the aryl group, and the heterocyclic group are optionally substituted with a halogen group, a nitro group, an amino group, a formyl group, an alkoxy group, or a hydroxy group, or R.sup.2 and R.sup.3 optionally form a ring together). The above mentioned composition t, wherein R.sup.1 is a divalent organic group derived from N,N-diphenyl-1,4-phenylenediamine.

Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.

Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.