Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Compositions for enhancing the luster and/or brilliance of jewelry and/or gem stones comprising a non-aqueous carrier and optionally additives and/or fragrances, and methods for making and using same.

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H.sub.2O.sub.2), ammonium persulfate ((NH.sub.4).sub.2S.sub.2O.sub.8), peroxymonosulfuric acid (H.sub.2SO.sub.5), ozone (O.sub.3) in de-ionized water, and sulfuric acid (H.sub.2SO.sub.4).

Methods of temporarily enhancing the luster and/or brilliance of a piece of jewelry, a gem stone, or a piece of jewelry including a gem stone including applying a non-aqueous composition to the piece of jewelry, the gem stone, or the piece of jewelry including a gem stone.

Methods of temporarily enhancing the luster and/or brilliance of a piece of jewelry, a gem stone, or a piece of jewelry including a gem stone including applying a non-aqueous composition to the piece of jewelry, the gem stone, or the piece of jewelry including a gem stone.