Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

The present invention is concerned with the use of hydrotreated synthetic Fischer-Tropsch waxes in polyolefin-based hot melt adhesive compositions, wherein the hydrotreated synthetic Fischer-Tropsch waxes modify the color degradation in the polyolefin-based hot melt adhesive compositions and are characterized by a polydispersity between 1.02 and 1.06.

The present invention is concerned with the use of hydrotreated synthetic Fischer-Tropsch waxes in polyolefin-based hot melt adhesive compositions, wherein the hydrotreated synthetic Fischer-Tropsch waxes modify the color degradation in the polyolefin-based hot melt adhesive compositions and are characterized by a polydispersity between 1.02 and 1.06.

Disclosed is a polyurethane hot-melt adhesive including: a thermoplastic polyurethane that is a reactant of a raw material including a polymer polyol, a polyisocyanate, and a chain extender, wherein X−Y≥15, where X represents a temperature (° C.) at which the polyurethane hot-melt adhesive has a melt viscosity of 2.0×10.sup.3 Pa.Math.s, and Y represents a temperature at which the polyurethane hot-melt adhesive has a melt viscosity of 1.0×10.sup.5 Pa.Math.s, and the polyurethane hot-melt adhesive has a 100% modulus of 2.5 MPa or more.

Disclosed is a polyurethane hot-melt adhesive including: a thermoplastic polyurethane that is a reactant of a raw material including a polymer polyol, a polyisocyanate, and a chain extender, wherein X−Y≥15, where X represents a temperature (° C.) at which the polyurethane hot-melt adhesive has a melt viscosity of 2.0×10.sup.3 Pa.Math.s, and Y represents a temperature at which the polyurethane hot-melt adhesive has a melt viscosity of 1.0×10.sup.5 Pa.Math.s, and the polyurethane hot-melt adhesive has a 100% modulus of 2.5 MPa or more.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.