The invention relates to a separating film based on polyolefins or ethylene copolymers with a content of organic and optionally inorganic pigment and at least one UV stabilizer. The separating film has a transmission percentage between 5 and 20% in the range from 400 to 700 nm and a transmission percentage of <2% in the range from 300 to 500 nm. Such separating films have the advantage that marking regions applied onto membranes which can be found below the separating film remain detectable, and adhesives which can be found below the separating film are effectively protected from UV light and premature aging by the addition of inorganic and organic pigments and UV stabilizers. The invention further relates to composite structures of corresponding separating films and adhesives, to water-tight membranes with coatings made of adhesive and separating films, and to uses of corresponding membranes for sealing structures against water.

The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

A transfer foil for a touch sensor includes a temporary support, a conductive layer, and a layer to be bonded to a support. The peel adhesion between the temporary support and the conductive layer is 0.20 N/mm or less. The layer to be bonded to a support has a thickness of 20 μm or less, and a modulus of elasticity of 0.10 MPa or more at a temperature of 130° C. The conductive layer includes a detection electrode that has a mesh pattern formed of a thin wire consisting of a conductive member and an external connection terminal that consists of a conductive member and is drawn from the detection electrode. The thin wire forming the mesh pattern of the detection electrode has a line width of 1 μm or more and 4.5 μm or less.

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Disclosed is a composition for reactive hot melt resin and a reactive hot melt film prepared from the resin, which resin composition includes a polyurethane resin having a linear structure, an isocyanate blocking agent having a plurality of functional groups, a reaction catalyst, a reaction retardant, etc. Preferably, the resin composition includes a polyurethane resin and an isocyanate blocking agent used as a latent curing agent, which are main components; a catalyst for accelerating the reaction; and a reaction retardant for securing long-term storability. Particularly, the composition for reactive hot melt resin further includes a heat-resistance enhancer, preferably nanosilica, for preventing the resin from melting down during no-sew press treatment to provide a performance to help maintenance of adhesion.

An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

The air and water barrier article includes a polymer-coated inelastic porous layer including a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer and an adhesive disposed on a major surface of the polymer-coated inelastic porous layer. The inelastic porous layer can include at least one of surface-modified fibers or natural cellulose fibers. The polymer-coated inelastic porous layer can at least one of a water strike through time of not more than 180 seconds or an absorbance capacity of at least one-half gram per 116 square centimeters. The adhesive may be exposed, in contact with a release surface, or adhered to a surface of a building component. A method of applying the air and water barrier article to a surface of a building component is also disclosed.

A release liner having filaments contacted to a major side thereof, then pressed thereinto. The filaments may be a thermoplastic or thermoset type material.

Films with structured adhesives and structured liners are described. Associated methods of making such films are also described. Films as described herein may be particularly suitable to providing adhesive films with structured adhesives with readily recyclable liners.

A method for waterproofing a substrate includes steps of: attaching a separation sheet to the surface of the substrate; and attaching a waterproofing membrane sheet to a surface of the separation sheet by a plurality of adhesive elements having a first and second major adhesive surface, wherein the separation sheet is a non-woven fabric sheet, or an embossed polyolefin membrane sheet and each adhesive element includes an adhesive layer composed of a pressure sensitive adhesive.