An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styrene elastomer; 5 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 42%.

An electronic device, according to various embodiments of the present disclosure, may comprise: a housing including a seating groove therein; a battery seated in the seating groove, at least a partial area of which includes a curved surface; and an adhesive member disposed between the battery and the seating groove and formed along at least a portion of an edge of the battery. The adhesive member may be formed having varied predetermined thicknesses, corresponding to a position of the battery.

The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.

This hot-melt composition contains, per 100 parts by mass of a hydrogenated styrene thermoplastic elastomer having a styrene-based polymer block at both ends thereof and a hydrogenated diene polymer block at a middle portion thereof, and having a mass-average molecular weight of 250,000 to 600,000, 150 to 450 parts by mass of an aromatic tackifying resin having a softening point of 135 to 160° C. and a mass-average molecular weight of 500 to 2,500, 100 to 500 parts by mass of a tackifying resin for a hydrogenated diene polymer block which has a softening point of 100 to 160° C., 500 to 1,500 parts by mass of a non-aromatic hydrocarbon oil having a kinematic viscosity at 40° C. of 90 mm.sup.2/s or higher, wherein 30% by mass or more of the non-aromatic hydrocarbon oil is a non-aromatic hydrocarbon oil having a kinematic viscosity at 40° C. of 300 to 500 mm.sup.2/s.

This hot-melt composition contains, per 100 parts by mass of a hydrogenated styrene thermoplastic elastomer having a styrene-based polymer block at both ends thereof and a hydrogenated diene polymer block at a middle portion thereof, and having a mass-average molecular weight of 250,000 to 600,000, 150 to 450 parts by mass of an aromatic tackifying resin having a softening point of 135 to 160° C. and a mass-average molecular weight of 500 to 2,500, 100 to 500 parts by mass of a tackifying resin for a hydrogenated diene polymer block which has a softening point of 100 to 160° C., 500 to 1,500 parts by mass of a non-aromatic hydrocarbon oil having a kinematic viscosity at 40° C. of 90 mm.sup.2/s or higher, wherein 30% by mass or more of the non-aromatic hydrocarbon oil is a non-aromatic hydrocarbon oil having a kinematic viscosity at 40° C. of 300 to 500 mm.sup.2/s.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

An exemplary embodiment of the present invention provides: an adhesive coating composition enabling adherence (coupling) of an electrical steel sheet without using conventional coupling methods such as welding, clamping, and interlocking; an electrical steel sheet laminate to which the same is applied; and a method for manufacturing the same.

An adhesive coating composition for an electrical steel sheet, according to an exemplary embodiment of the present invention, includes, on the basis of 100 wt % of total solids: 15 to 70 wt % of a first composition containing an organic resin and an organic/inorganic composite in which inorganic nanoparticles are substituted for an organic resin; 20 to 80 wt % of a second composition containing a metal phosphate and phosphoric acid; and 1 to 10 wt % of a coupling agent.

The coupling agent may contain one or more of a silane-based coupling agent, a titanate-based coupling agent, and an aluminate-based coupling agent.

The present invention provides a mask adhesive that plastically deforms easily, no adhesive residue remains after peeling from the mask, ease of handling is excellent, and haze on a pellicle film is unlikely to be increased. A mask adhesive resolving this problem contains a thermoplastic elastomer (A) for which the temperature at which the loss tangent measured at a frequency of 1 Hz is at a maximum value is 20 to 30 C., a tackifier resin (B), and a process oil (C). The total of the proportion (% CP) of paraffin carbon and the proportion (% CN) of naphthene carbon in the process oil (C) is 50% or more. The temperature of the mask adhesive at which the loss tangent measured at a frequency of 1 Hz is at a maximum value is 10 to 30 C., and the sulfur content of the mask adhesive is 300 g/g or less.