The present invention provides a manufacturing method of carbon nanotube conductive microspheres and conductive glue. in comparison with a manufacturing method of carbon nanotube conductive microspheres provided by the present invention provides and the conventional two-step method which needs to prepare the plastic or resin microspheres and then plating the conductive metal, it is not necessary to respectively prepare the plastic or resin microspheres and the conductive layer, instead, the carbon nanotube are mixed in the polymer microspheres when the styrene monomer, the crosslinking agent and the initiator have a crosslinking reaction to form the polymer microspheres with a method of spray-granulation. Only one step is needed to prepare the conductive microspheres with carbon nanotube as the conductive medium, which can simplify the process, reduce the process, save cost. With mixing the carbon nanotube inside the polymer microspheres, the thermal mismatching between the carbon nanotubes and the resin can be illuminated, to ensure the conductive properties of conductive microspheres. Furthermore, the entire preparing process has no heavy metal salts; the bio-toxicity is reduced and no environmental pollution. The present invention provides a conductive glue, which comprises the carbon nanotube conductive microspheres manufactured by the manufacturing method of carbon nanotube conductive microspheres are easy to manufacture, lower cost, lower impact of thermal mismatching, great conductive properties, and no environmental pollution.

A hot-melt composition has excellent workability, hot flow resistance, balance between adhesion and detachability, volatility resistance, and hot creep resistance. The hot-melt composition includes: as thermoplastic elastomers, a styrene-based thermoplastic elastomer having a weight average molecular weight of 300,000 or more, a styrene-based thermoplastic elastomer having a styrene content of no greater than 20% by mass, and an olefin-based thermoplastic elastomer including an ethylene propylene rubber and/or butyl rubber; as tackifiers, an aromatic petroleum resin, a terpene phenol resin, and an amorphous polyalphaolefin; a high molecular weight paraffin oil having a weight average molecular weight of 1,000 or more; and a low molecular weight paraffin oil having a weight average molecular weight of less than 1,000.

A hot-melt composition has excellent workability, hot flow resistance, balance between adhesion and detachability, volatility resistance, and hot creep resistance. The hot-melt composition includes: as thermoplastic elastomers, a styrene-based thermoplastic elastomer having a weight average molecular weight of 300,000 or more, a styrene-based thermoplastic elastomer having a styrene content of no greater than 20% by mass, and an olefin-based thermoplastic elastomer including an ethylene propylene rubber and/or butyl rubber; as tackifiers, an aromatic petroleum resin, a terpene phenol resin, and an amorphous polyalphaolefin; a high molecular weight paraffin oil having a weight average molecular weight of 1,000 or more; and a low molecular weight paraffin oil having a weight average molecular weight of less than 1,000.

An electronic device, according to various embodiments of the present disclosure, may comprise: a housing including a seating groove therein; a battery seated in the seating groove, at least a partial area of which includes a curved surface; and an adhesive member disposed between the battery and the seating groove and formed along at least a portion of an edge of the battery. The adhesive member may be formed having varied predetermined thicknesses, corresponding to a position of the battery.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

A manufacturing method of carbon nanotube conductive microspheres, which can simplify the process, reduce the process, save cost, and reduce the impact of thermal mismatching, to ensure the conductive properties of conductive microspheres, and not pollute the environment. The carbon nanotubes are mixed in the polymer microspheres when the styrene monomer, the crosslinking agent and the initiator have a crosslinking reaction to form the polymer microspheres with a method of spray-granulation. Only one step is needed to prepare the conductive microspheres with carbon nanotube as the conductive medium, which can simplify the process, reduce the process, save cost. With mixing the carbon nanotube inside the polymer microspheres, the thermal mismatching between the carbon nanotubes and the resin can be illuminated, to ensure the conductive properties of conductive microspheres. Furthermore, the entire preparing process has no heavy metal salts; the bio-toxicity is reduced and no environmental pollution.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200 C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200 C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

An adhesion composition comprising a) a first polymer that is selected from the group consisting of acrylic polymers, acrylonitrile butadiene, butyl rubber, cellulose acetate, cellulose butyrate, epoxy resins, ethylene vinyl acetate, natural rubber, neoprene, phenolic polymers, polyurethanes, polyvinyl acetate, polyvinyl alcohol, styrene butadiene rubber, casein, dextrin, starch, copolymers thereof and combinations thereof; b) a second polymer selected from the group consisting of ethylene-acrylic acid copolymer, oxidized polyethylene, oxidized ethylene-vinyl acetate copolymer, maleated polyolefin and combinations thereof; and c) a surfactant; where the composition is water-based, having a solids content of greater than about 30% based on the total weight of the composition, with a particle size of about 10 nm to about 2000 nm, and is adapted for adhesion to substrates; and where the first and second polymers are different. The adhesion composition can also comprise a tackifier resin selected from the group consisting of rosin ester resin, rosin acid resin, synthetic hydrocarbon resin, synthetic terpenic resin and combinations thereof. Applications of the composition are also disclosed.