The present invention is a material for forming an adhesive film formed between a silicon-containing middle layer film and a resist upper layer film, the material for forming an adhesive film containing: (A) a resin having a structural unit shown by the following general formula (1); (B) a crosslinking agent containing one or more compounds shown by the following general formula (2); (C) a photo-acid generator; and (D) an organic solvent. This provides: a material for forming an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and that also makes it possible to form an excellent pattern profile; a patterning process using the material; and a method for forming the adhesive film.

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Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-(meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making the urea (multi)-(meth)acrylate (multi)-silanes and their use in composite films and electronic devices are described.

Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-(meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making the urea (multi)-(meth)acrylate (multi)-silanes and their use in composite films and electronic devices are described.

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer and (II) an aminosiloxane. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. A method of preparing the curable composition is also disclosed, and includes reacting (A) an acryloxy-functional organosilicon component, (B) an epoxy-functional acrylate component, and optionally (C) an acrylate component, to give the epoxide-functional silicone-acrylate polymer (I), and combining the epoxide-functional silicone-acrylate polymer (I) with the aminosiloxane (II). An aminosiloxane-silicone-acrylate copolymer prepared with the composition, a cured product comprising the same, and methods of preparing the same, are also disclosed.

A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer and (II) an aminosiloxane. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. A method of preparing the curable composition is also disclosed, and includes reacting (A) an acryloxy-functional organosilicon component, (B) an epoxy-functional acrylate component, and optionally (C) an acrylate component, to give the epoxide-functional silicone-acrylate polymer (I), and combining the epoxide-functional silicone-acrylate polymer (I) with the aminosiloxane (II). An aminosiloxane-silicone-acrylate copolymer prepared with the composition, a cured product comprising the same, and methods of preparing the same, are also disclosed.

Provided is a polymer compound having a repeating unit represented by Formula 1A below:

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wherein in Formula 1A, Z.sup.1 represents a hydrogen atom or a monovalent group, R.sup.1 represents a group represented by Formula 1B, L.sup.1 represents a divalent group, n represents an integer of 1 or more, and in in Formula 1B, L.sup.2 represents a single bond or a divalent group, R.sup.2 represents a group selected from the group consisting of a hydroxy group and a group represented by *—OR.sup.3, R.sup.3 represents a hydrocarbon group which may have a hetero atom, a plurality of R.sup.3's may be bonded to each other to form a ring, * represents a bonding position, m represents an integer of 1 to 5, and a plurality of L.sup.1's and a plurality of R.sup.2's may be the same as or different from each other.

Provided is a polymer compound having a repeating unit represented by Formula 1A below:

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wherein in Formula 1A, Z.sup.1 represents a hydrogen atom or a monovalent group, R.sup.1 represents a group represented by Formula 1B, L.sup.1 represents a divalent group, n represents an integer of 1 or more, and in in Formula 1B, L.sup.2 represents a single bond or a divalent group, R.sup.2 represents a group selected from the group consisting of a hydroxy group and a group represented by *—OR.sup.3, R.sup.3 represents a hydrocarbon group which may have a hetero atom, a plurality of R.sup.3's may be bonded to each other to form a ring, * represents a bonding position, m represents an integer of 1 to 5, and a plurality of L.sup.1's and a plurality of R.sup.2's may be the same as or different from each other.

An adhesive layer (20a) has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.