Disclosed are a battery binder, a lithium-ion battery negative electrode plate and a lithium-ion battery. The adhesive contains a polymer having both hydrophillic and hydrophobic units. In addition, in the polymer, a medium-to-low molecular weight polymer is less than 5 wt % or less based on total amount of the polymer, and the molecular weight of the medium-to-low molecular weight polymer is less than 10000. The adhesive has a strong adhesive force, and the preparation method therefor is simple and low cost. Compared with an exiting negative electrode plate adhesive amount of 2.5%-5%, an adhesive amount of 1.5-2% can not only show a higher bonding force, but also the proportion of active material can be increased, thereby increasing the energy density of a battery.

Disclosed are a battery binder, a lithium-ion battery negative electrode plate and a lithium-ion battery. The adhesive contains a polymer having both hydrophillic and hydrophobic units. In addition, in the polymer, a medium-to-low molecular weight polymer is less than 5 wt % or less based on total amount of the polymer, and the molecular weight of the medium-to-low molecular weight polymer is less than 10000. The adhesive has a strong adhesive force, and the preparation method therefor is simple and low cost. Compared with an exiting negative electrode plate adhesive amount of 2.5%-5%, an adhesive amount of 1.5-2% can not only show a higher bonding force, but also the proportion of active material can be increased, thereby increasing the energy density of a battery.

An aqueous binder composition for a secondary battery electrode is provided, comprising a copolymer and a dispersion medium, wherein the copolymer comprises a structural unit (a) derived from a carboxylic acid group-containing monomer, a structural unit (b) derived from an amide group-containing monomer and a structural unit (c) derived from a nitrile group-containing monomer, with an improved binding capability. In addition, battery cells comprising the cathode prepared using the binder composition disclosed herein exhibits exceptional electrochemical performance.

An easily water-dismantlable adhesive composition containing a 2-cyanoacrylate compound represented by Formula (1): in which L.sup.1's each independently represent —CH.sub.2CH.sub.2—, —CH(R.sup.1)CH.sub.2—, or —CH.sub.2CH(R.sup.1)—, R.sup.1 represents an alkyl group having 1 to 3 carbon atoms, R.sup.2 represents a linear or branched alkyl group having 1 to 4 carbon atoms, p represents an integer of 3 to 6, and, among p -L.sup.1-O—'s in Formula (1), 2 to 4 -L.sup.1-O—'s are —CH.sub.2CH.sub.2—O—, and 0 to 2 -L.sup.1-O—'s are —CH(R.sup.1)CH.sub.2— and/or —CH.sub.2CH(R.sup.1)—O—.

##STR00001##

An easily water-dismantlable adhesive composition containing a 2-cyanoacrylate compound represented by Formula (1): in which L.sup.1's each independently represent —CH.sub.2CH.sub.2—, —CH(R.sup.1)CH.sub.2—, or —CH.sub.2CH(R.sup.1)—, R.sup.1 represents an alkyl group having 1 to 3 carbon atoms, R.sup.2 represents a linear or branched alkyl group having 1 to 4 carbon atoms, p represents an integer of 3 to 6, and, among p -L.sup.1-O—'s in Formula (1), 2 to 4 -L.sup.1-O—'s are —CH.sub.2CH.sub.2—O—, and 0 to 2 -L.sup.1-O—'s are —CH(R.sup.1)CH.sub.2— and/or —CH.sub.2CH(R.sup.1)—O—.

##STR00001##

An elastomeric mastic sealant composition and method of manufacturing are disclosed. In certain embodiments, the composition may include between about 13 and about 19 weight percent or between about 11 and about 15 volume percent of acrylate-acrylonitrile copolymer. The composition may further comprise one or more of between about 36 and about 41 weight percent or between about 29 and about 34 volume percent of styrenated acrylic polymer; between about 1 and about 2 weight percent or between about 0.9 and about 1.7 volume percent of surfactant; between about 0.6 and about 1.4 weight percent or between about 0.4 and about 1 volume percent of dispersant; and between about 0.4 and about 1 weight percent or between about 29 and about 40 volume percent of pre-expanded compressible microspheres having an organic outer surface and introduced by a closed mixing system into the copolymer. In some implementations, the disclosed composition and method forms a closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that once cured, is elastic and compressible under pressure without unduly protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant in such implementations to function as a gasket, and to have properties including vibration damping, insulating, and/or condensation resistance.

An elastomeric mastic sealant composition and method of manufacturing are disclosed. In certain embodiments, the composition may include between about 13 and about 19 weight percent or between about 11 and about 15 volume percent of acrylate-acrylonitrile copolymer. The composition may further comprise one or more of between about 36 and about 41 weight percent or between about 29 and about 34 volume percent of styrenated acrylic polymer; between about 1 and about 2 weight percent or between about 0.9 and about 1.7 volume percent of surfactant; between about 0.6 and about 1.4 weight percent or between about 0.4 and about 1 volume percent of dispersant; and between about 0.4 and about 1 weight percent or between about 29 and about 40 volume percent of pre-expanded compressible microspheres having an organic outer surface and introduced by a closed mixing system into the copolymer. In some implementations, the disclosed composition and method forms a closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that once cured, is elastic and compressible under pressure without unduly protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant in such implementations to function as a gasket, and to have properties including vibration damping, insulating, and/or condensation resistance.

According to one embodiment, a nonaqueous electrolyte secondary battery includes a positive electrode, a negative electrode, and a nonaqueous electrolyte. The negative electrode includes a negative electrode current collector and a negative electrode mixed-material layer on the negative electrode current collector. The negative electrode mixed-material layer includes a titanium-containing metal oxide and a binder including an acrylic resin. The negative electrode satisfies α/β>1.36×10.sup.−2, where “α” is a peel strength (N/m) between the current collector and the negative electrode mixed-material layer, and “β” is a cutting strength (N/m) according to a surface and interfacial cutting method in the negative electrode mixed-material layer.

According to one embodiment, a nonaqueous electrolyte secondary battery includes a positive electrode, a negative electrode, and a nonaqueous electrolyte. The negative electrode includes a negative electrode current collector and a negative electrode mixed-material layer on the negative electrode current collector. The negative electrode mixed-material layer includes a titanium-containing metal oxide and a binder including an acrylic resin. The negative electrode satisfies α/β>1.36×10.sup.−2, where “α” is a peel strength (N/m) between the current collector and the negative electrode mixed-material layer, and “β” is a cutting strength (N/m) according to a surface and interfacial cutting method in the negative electrode mixed-material layer.

An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.