Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

A composite comprises: a reinforcing element (10), an adhesive layer (14) made from an adhesive composition, and an elastomeric body made from an elastomeric matrix comprising an ethylene/alpha-olefin type elastomer and/or a polychloroprene elastomer. The adhesive composition comprises a resin based: on a polyphenol comprising an aromatic ring bearing two hydroxyl functions in the meta position relative to one another, the two positions ortho to one of the hydroxyl functions being unsubstituted; and/or on a monophenol comprising a six-membered aromatic ring bearing a single hydroxyl function, the two ortho positions being unsubstituted, or an ortho position and the para position being unsubstituted, and on a compound comprising an aromatic ring bearing two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function.

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator.

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator.

A resin-metal composite member for a tire, the member including: a metal member; an adhesive layer; and a covering resin layer in this order, wherein: the adhesive layer includes a continuous phase that contains a polyester-based thermoplastic elastomer having a polar functional group, and a discontinuous phase that contains at least one of a polyphenylene ether resin or a styrene resin and contains a styrene-based elastomer having an epoxy group.

A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.

A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents CO, S, or SO.sub.2, and Y represents S, SO.sub.2, O, CO, COO, or CONH. n represents an integer of 0 or greater.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents CO, S, or SO.sub.2, and Y represents S, SO.sub.2, O, CO, COO, or CONH. n represents an integer of 0 or greater.