A formaldehyde free adhesive composition and a plywood obtained from the adhesive composition is provided, and the plywood has a balanced performance, such as high adhesion strength, sufficient pot-life, and good workability.

A nail tip curing composition includes an Extend Gel, an edge-off flat brush, a nail filing device, a plurality of GEL-X tips, a pH Bonder, and a Non-Acidic Gel Primer. The pH Bonder forms a pH Bonder layer on a surface of a fingernail. The Non-Acidic Gel Primer forms a Non-Acidic Gel Prime layer overlapped on the pH Bonder layer. The Extend Gel forms an Extend Gel layer overlapped on the Non-Acidic Gel Prime layer. The GEL-X tip is filed by the nail filing device and the Extend Gel is applied on an underside contact surface of the Gel-X tip by the edge-off flat brush. The underside contact surface of the Gel-X tip is contacted with the Extend Gel layer on the fingernail in such a manner that the Gel-X tip is firmly affixed on the fingernail.

A nail tip curing composition includes an Extend Gel, an edge-off flat brush, a nail filing device, a plurality of GEL-X tips, a pH Bonder, and a Non-Acidic Gel Primer. The pH Bonder forms a pH Bonder layer on a surface of a fingernail. The Non-Acidic Gel Primer forms a Non-Acidic Gel Prime layer overlapped on the pH Bonder layer. The Extend Gel forms an Extend Gel layer overlapped on the Non-Acidic Gel Prime layer. The GEL-X tip is filed by the nail filing device and the Extend Gel is applied on an underside contact surface of the Gel-X tip by the edge-off flat brush. The underside contact surface of the Gel-X tip is contacted with the Extend Gel layer on the fingernail in such a manner that the Gel-X tip is firmly affixed on the fingernail.

A process comprises (i) providing an isocyanate component A that is a reaction product of an aliphatic polyisocyanate, an aromatic polyisocyanate, an aliphatic polyester polyol, and a polyether polyol; (ii) providing a polyol component B comprising an aliphatic polyester polyol and a polyether polyol; (iii) mixing A and B to form a solventless adhesive (SLA) composition component A and component B each comprises an aliphatic polyester polyol having a viscosity from 800 to 6000 mPa.Math.s at 25° C. and a hydroxyl number from 60 to 180 mg KOH/g; the SLA composition has (a) an initial viscosity at 40° C. from 500 to 1600 mPa.Math.s, (b) an increasing viscosity ratio from 100% to 112% of the initial viscosity after the SLA composition stands at 40° C. for 10 min, and (c) an end viscosity at 40° C. from 120% to 210% of the initial viscosity at 40 min after forming the SLA composition.

A process comprises (i) providing an isocyanate component A that is a reaction product of an aliphatic polyisocyanate, an aromatic polyisocyanate, an aliphatic polyester polyol, and a polyether polyol; (ii) providing a polyol component B comprising an aliphatic polyester polyol and a polyether polyol; (iii) mixing A and B to form a solventless adhesive (SLA) composition component A and component B each comprises an aliphatic polyester polyol having a viscosity from 800 to 6000 mPa.Math.s at 25° C. and a hydroxyl number from 60 to 180 mg KOH/g; the SLA composition has (a) an initial viscosity at 40° C. from 500 to 1600 mPa.Math.s, (b) an increasing viscosity ratio from 100% to 112% of the initial viscosity after the SLA composition stands at 40° C. for 10 min, and (c) an end viscosity at 40° C. from 120% to 210% of the initial viscosity at 40 min after forming the SLA composition.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

An object of the present invention is to provide a urethane adhesive composition excellent in adhesion durability for an olefin resin. The present invention is a urethane adhesive composition containing a urethane prepolymer having an isocyanate group, an isocyanurate compound of pentamethylene diisocyanate and/or hexamethylene diisocyanate, and a secondary aminosilane compound.

Provided herein is a two-component thermal interface material.