Provided herein is a two-component thermal interface material.

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

The present invention relates to an optical laminate and a flexible display panel including the same, and more particularly, to an optical laminate including a self-restoration barrier adhesive layer and a flexible display panel including the same.

The present invention relates to an optical laminate and a flexible display panel including the same, and more particularly, to an optical laminate including a self-restoration barrier adhesive layer and a flexible display panel including the same.

An artificial nail tip having a plurality of smile line guidelines embedded on the surface of the artificial nail tip, which allows a user or a nail professional to easily create smile lines of varying depths on the artificial nail tip is described.

An artificial nail tip having a plurality of smile line guidelines embedded on the surface of the artificial nail tip, which allows a user or a nail professional to easily create smile lines of varying depths on the artificial nail tip is described.

Disclosed a no-added formaldehyde composite wood product binder, a no-added formaldehyde composite wood product manufactured by same, and a preparation method for the composite wood product. The no-added formaldehyde composite wood product binder comprises an agent A and an agent B. The agent A is an isocyanate-based binder, and the agent B is an aqueous dispersion of polyester based aliphatic polyurethane and/or a modified polyester-based aliphatic polyurethane. The no-added formaldehyde composite wood product is formed under hot-pressing after a wooden and/or straw material is mixed with the no-added formaldehyde composite wood product binder. The composite wood product manufactured by the no-added formaldehyde composite wood product binder has excellent water-proof and mechanical properties and a good saw cutting performance, and the amount of isocyanate used is also reduced, thereby reducing costs.