An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

Segmented silicone polyamide block copolymers that comprise dimer acid residues and articles containing the same.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, an adhesive composition is provided comprising a reaction product of a polyacid selected from the group consisting of an aromatic polyacid, an aliphatic polyacid, an aliphatic polyacid with an aromatic group, and combinations thereof, or a diglycidyl ether; and a polyamine; and one or more compounds selected from the group consisting of a branched aliphatic acid, a cyclic aliphatic acid with a cyclic aliphatic group, a linear aliphatic, and combinations thereof.

A thermosetting resin composition excellent in dimensional stability during curing and adhesiveness, heat resistance, moist heat resistance, electrical insulating properties, flexibility, low dielectric properties and low dissipation factor properties after curing is provided.

A thermosetting resin composition according to the present invention is a thermosetting resin composition containing a polyamide (A) made by polymerization of a polybasic acid monomer and a polyamine monomer and having a phenolic hydroxyl group on a side chain, and a compound (B) with a functionality of three or more that can react with the phenolic hydroxyl group. Monomers that form the polyamide (A) include a monomer having a phenolic hydroxyl group and a monomer having a hydrocarbon group with a carbon number of 20 to 60 (excluding an aromatic ring to which the phenolic hydroxyl group bonds) and having a cyclic structure with a carbon number of 5 to 10.

The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst.