Materials from the group consisting of a) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked, b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates and d) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,
are suitable as adhesive for the bonding of metals, plastics, concrete and/or ceramics.

An amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):

—C≡CX.sup.1

at a molecular end.

An amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):

—C≡CX.sup.1

at a molecular end.

Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000,

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000,

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000,

##STR00001## wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.

Provided is a polyimide precursor including a polyimide precursor obtained by a reaction between a diamine compound and a tetracarboxylic dianhydride compound, in which the diamine compound contains at least one type selected from the group consisting of an aromatic diamine and an alicyclic diamine, the tetracarboxylic dianhydride compound contains at least one type selected from the group consisting of an aromatic tetracarboxylic dianhydride and an alicyclic tetracarboxylic dianhydride, and the total amount of the alicyclic diamine and the alicyclic tetracarboxylic dianhydride is 5.0 mol% or more and 70.0 mol% or less with respect to the total amount of constituent monomers of the polyimide precursor.

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).