A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.

A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.

An object of the present invention is to provide a polyimide copolymer excelling in solder heat resistance and an adhesive property, and a molded article thereof. A polyimide copolymer is obtained by copolymerizing: (A) an acid dianhydride ingredient; (B) a diamine and/or diisocyanate ingredient represented by the following general formulas (1) to (3):

##STR00001##

where in the formulas, X is an amino group or an isocyanate group, each of R.sup.1 to R.sup.8 is independently a hydrogen atom, an alkyl group having a carbon number of 1 to 4, an alkenyl group having a carbon number of 2 to 4 or an alkoxy group having a carbon number of 1 to 4, at least one of R.sup.1 to R.sup.4 is not a hydrogen atom, and at least one of R.sup.5 to R.sup.8 is not a hydrogen atom; and (C) a diamine and/or diisocyanate ingredient having at least one kind selected from an ether group and a carboxyl group.

A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: ##STR00001## In Chemical Formula 1C and Chemical Formula 2, R.sup.5 to R.sup.13, and n3 to n8 are the same as in the specification.

A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: ##STR00001## In Chemical Formula 1C and Chemical Formula 2, R.sup.5 to R.sup.13, and n3 to n8 are the same as in the specification.

A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.

A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.

The present application discloses an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. According to the insulated wire, a bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed. The bonding layer can be well bonded with both the conductor material and the PEEK resin insulating layer, so that the produced insulated wire rod has good adhesion, and cracking and detachment will not appear during application.

The present application discloses an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. According to the insulated wire, a bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed. The bonding layer can be well bonded with both the conductor material and the PEEK resin insulating layer, so that the produced insulated wire rod has good adhesion, and cracking and detachment will not appear during application.

The present application discloses an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. According to the insulated wire, a bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed. The bonding layer can be well bonded with both the conductor material and the PEEK resin insulating layer, so that the produced insulated wire rod has good adhesion, and cracking and detachment will not appear during application.