The present disclosure generally relates to a stretchable anti-fogging tape (SAT) that can be applied to diverse transparent materials with varied curvatures for persistent fogging prevention. The SAT comprises three synergistically-combined transparent layers: i) a stretchable middle layer with high elastic recovery to keep transparent materials tightly bound; ii) an anti-fogging top layer to impart hydrophilicity to transparent materials; and iii) an adhesive bottom layer to form robust yet reversible adhesion between transparent materials and SATs. The SAT can be configured to have water condensate form a predominantly continuous film thereon in response to a high humidity environment At least two applications are demonstrated, including the SAT-adhered eyeglasses and goggles for clear fog-free vision, and the SAT-adhered condensation cover for efficient solar-powered freshwater production.

A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO.sub.1/2], [(OZ).sub.qSiO.sub.(4-q)/2] and at least one of [(OZ).sub.tR.sup.EPSiO.sub.(3-t)/2] and [(OZ).sub.dRR.sup.EPSiO.sub.(2-d)/2]; where: each R is independently in each occurrence selected from hydrocarbyls, R.sup.EP is an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.

Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.

A temporary adhesive material for substrate processing adhesion to support the substrate opposite to a surface, the material including: a first temporary adhesive layer; and a second temporary adhesive layer distinct from the first layer, where at least one of the first layer and the second layer has a minimum viscosity of 1 Pa.Math.s or higher and 10,000 Pa.Math.s or lower within 130° C. to 250° C., where: the temporary adhesive material contains 10 parts by mass or more and 100 parts by mass or less of a siloxane bond-containing polymer having a weight-average of 3,000 or more and 700,000 or less as measured by GPC based on a total mass of 100 parts. A temporary material for substrate processing that facilitates the adhesion and separation, allows a quick layer formation, has dimensional resistance to thermal processes, and can raise the productivity of substrates; and manufacturing a laminate using the same.

A temporary adhesive material for substrate processing adhesion to support the substrate opposite to a surface, the material including: a first temporary adhesive layer; and a second temporary adhesive layer distinct from the first layer, where at least one of the first layer and the second layer has a minimum viscosity of 1 Pa.Math.s or higher and 10,000 Pa.Math.s or lower within 130° C. to 250° C., where: the temporary adhesive material contains 10 parts by mass or more and 100 parts by mass or less of a siloxane bond-containing polymer having a weight-average of 3,000 or more and 700,000 or less as measured by GPC based on a total mass of 100 parts. A temporary material for substrate processing that facilitates the adhesion and separation, allows a quick layer formation, has dimensional resistance to thermal processes, and can raise the productivity of substrates; and manufacturing a laminate using the same.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

Provided is a method for manufacturing a semiconductor device suitable for achieving low wiring resistance between semiconductor elements that is bonded via an adhesive layer and multi-layered. The method according to the present invention is as follows. First, a wafer laminate (W) is prepared, the wafer laminate (W) including a wafer (10) having a circuit forming surface (10a), a wafer (20) having a main surface (20a) and a back surface (20b), and an adhesive layer (30) containing an SiOC-based polymer. Then, a hole (H) is formed in the wafer laminate (W) by etching the wafer laminate (W) from the wafer (20) side via a mask pattern masking a portion of the main surface (20a) side of the wafer (20), the hole (H) extending through the wafer (20) and the adhesive layer (30) and reaching a wiring pattern (12b) in the wafer (10). Then, an insulating film (41) is formed on an inner surface of the hole (H). Then, the insulating film (41) on a bottom surface of the hole (H) is removed. Then, the wafer laminate (W) is subjected to a cleaning treatment (an oxygen plasma treatment and/or an Ar sputtering treatment). Then, a conductive portion is formed in the hole (H).

A moisture curable composition capable of cure to an elastomeric body, the composition comprising: (i) an organopolysiloxane polymer having at least two silicon-bonded hydroxyl or hydrolysable groups per molecule and a viscosity of from 1,000 to 75,000 maPa.Math.s at 25° C.; (ii) a siloxane and/or silane cross-linker; (iii) an organosilicate resin comprising SiO.sub.4/2 (Q) siloxane units and R.sup.2.sub.3SiO.sub.1/2 (M) siloxane units wherein each R.sup.2 is selected from hydrocarbon groups, —OH and/or alkoxy containing groups and which M groups are reactive with components (i) and/or (ii); and (iv)_a condensation cure catalyst. The organosilicate resin (iii) is generally used to reinforce the composition.

A silicone elastomer composition which is generally storage stable, and cures to an elastomeric body, comprising; (i) an organopolysiloxane polymer having at least two hydroxyl or hydrolysable groups; (ii) a siloxane and/or silane cross-linker having at least three groups per molecule which are reactable with the hydroxyl or hydrolysable groups in the organopolysiloxane polymer (i); (iii) a solid organosilicate resin which is substantially unreactive with components (i) and (ii) and comprising R.sub.3.sup.2SiO.sub.1/2 and SiO.sub.4/2 siloxane units, wherein the molar ratio of the R.sub.3.sup.2SiO.sub.1/2 siloxane units to SiO.sub.4/2 siloxane units is from 0.5:1 to 1.2:1, and R.sup.2 is selected from hydrocarbon groups; and optionally (iv) a suitable condensation cure catalyst. The solid organosilicate resin (iii) is generally utilised to create a low modulus room temperature vulcanisable (RTV) silicone composition which when cured may be used as a coating, an adhesive or a sealant having high movement capability.