A silicone elastomer composition which is generally storage stable, and cures to an elastomeric body, comprising; (i) an organopolysiloxane polymer having at least two hydroxyl or hydrolysable groups; (ii) a siloxane and/or silane cross-linker having at least three groups per molecule which are reactable with the hydroxyl or hydrolysable groups in the organopolysiloxane polymer (i); (iii) a solid organosilicate resin which is substantially unreactive with components (i) and (ii) and comprising R.sub.3.sup.2SiO.sub.1/2 and SiO.sub.4/2 siloxane units, wherein the molar ratio of the R.sub.3.sup.2SiO.sub.1/2 siloxane units to SiO.sub.4/2 siloxane units is from 0.5:1 to 1.2:1, and R.sup.2 is selected from hydrocarbon groups; and optionally (iv) a suitable condensation cure catalyst. The solid organosilicate resin (iii) is generally utilised to create a low modulus room temperature vulcanisable (RTV) silicone composition which when cured may be used as a coating, an adhesive or a sealant having high movement capability.

Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.

The present invention relates to two-component (2K) silicone-based adhesive compositions comprising an adhesion promotor, as well as to the use of such compositions. Furthermore, the present invention is directed to the use of a —Si(OR.sup.a).sub.3 terminated polyorganosiloxane prepolymer, as described herein, for improving the adhesive properties of silicone-based adhesive compositions.

The present invention relates to two-component (2K) silicone-based adhesive compositions comprising an adhesion promotor, as well as to the use of such compositions. Furthermore, the present invention is directed to the use of a —Si(OR.sup.a).sub.3 terminated polyorganosiloxane prepolymer, as described herein, for improving the adhesive properties of silicone-based adhesive compositions.

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acryloxyalkyl-functional group in a pendant position and optionally a silicon bonded aliphatically unsaturated hydrocarbon group in a terminal position. The silicone hybrid pressure sensitive adhesive composition can be cured via hydrosilylation reaction on a surface of a substrate to form a protective film. The protective film can be used to protect a passivation layer during a process for fabricating an (opto)electronic device such as a flexible organic light emitting diode display. The protective film can be exposed to radiation to reduce tack and facilitate detaching the protective film from the passivation layer.

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acryloxyalkyl-functional group in a pendant position and optionally a silicon bonded aliphatically unsaturated hydrocarbon group in a terminal position. The silicone hybrid pressure sensitive adhesive composition can be cured via hydrosilylation reaction on a surface of a substrate to form a protective film. The protective film can be used to protect a passivation layer during a process for fabricating an (opto)electronic device such as a flexible organic light emitting diode display. The protective film can be exposed to radiation to reduce tack and facilitate detaching the protective film from the passivation layer.

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acryloxyalkyl-functional group in a pendant position and optionally a silicon bonded aliphatically unsaturated hydrocarbon group in a terminal position. The silicone hybrid pressure sensitive adhesive composition can be cured via hydrosilylation reaction on a surface of a substrate to form a protective film. The protective film can be used to protect a passivation layer during a process for fabricating an (opto)electronic device such as a flexible organic light emitting diode display. The protective film can be exposed to radiation to reduce tack and facilitate detaching the protective film from the passivation layer.

An ultraviolet (UV) curable organopolysiloxane composition with excellent workability when applied to a substrate is provided, in which a product obtained by curing the composition has a low dielectric constant. The UV curable organopolysiloxane composition comprises (A) one or more organosiloxane and/or organopolysiloxane having an average of two or more UV reactive functional groups in one molecule, and (B) one or more organosilane, organosiloxane, and/or organopolysiloxane having one UV reactive functional group in one molecule. An organic solvent is not included in the composition. In addition to components (A) and (B), the composition can comprise one or a plurality of additives selected from a group consisting of: (D1) nonionic surfactants not containing a silicon atom and are not acrylic; (D2) nonionic surfactants containing a silicon atom and having an HLB value of 4 or less; and (D3) silicone oils with a viscosity of 90 mPa-s or less at 25° C.

An ultraviolet (UV) curable organopolysiloxane composition with excellent workability when applied to a substrate is provided, in which a product obtained by curing the composition has a low dielectric constant. The UV curable organopolysiloxane composition comprises (A) one or more organosiloxane and/or organopolysiloxane having an average of two or more UV reactive functional groups in one molecule, and (B) one or more organosilane, organosiloxane, and/or organopolysiloxane having one UV reactive functional group in one molecule. An organic solvent is not included in the composition. In addition to components (A) and (B), the composition can comprise one or a plurality of additives selected from a group consisting of: (D1) nonionic surfactants not containing a silicon atom and are not acrylic; (D2) nonionic surfactants containing a silicon atom and having an HLB value of 4 or less; and (D3) silicone oils with a viscosity of 90 mPa-s or less at 25° C.

A laminate containing: an adhesion layer-applied substrate containing a substrate and an adhesion layer disposed on the substrate, the adhesion layer containing an adhesive emulsion particle (F), an inorganic oxide (G) and a light-shielding agent (S1); and a hard coating layer (C) disposed on the adhesion layer-applied substrate and containing a matrix component (B) containing an inorganic oxide (D), wherein a haze value H1 of the adhesion layer-applied substrate is larger than a haze value H2 of the laminate.