A peel off assembly for exposing a safety feature comprising an aversive agent for a battery includes a first adhesive layer adhered to a base layer. Optionally, a layer comprising a colorant is disposed over and coupled to the first adhesive layer. A layer comprising a water-soluble material and an aversive agent is disposed over and coupled to the first adhesive layer. A second adhesive layer is disposed over and coupled to the layer comprising a water-soluble material. A kill strip layer is disposed between the second adhesive layer and the base layer. Optionally, a label is disposed over and coupled to the second adhesive layer. The second adhesive layer is adapted and arranged to release from the layer comprising the water-soluble material, when a peel force is applied such that the second adhesive layer and the kill strip layer are removable from the layer comprising a water-soluble material when the peel force is applied to the second adhesive layer.

A multilayer tape is provided. A method of masking a surface is also provided. The multilayer tape includes an inner layer, at least one middle layer, and an outer carrier layer. The inner layer has a pair of parallel adhesive strips demarking an inner gap having a predetermined width. The middle layer is adhered to the inner layer and has a pair of parallel adhesive strips demarking a middle gap narrower than the inner gap. The outer carrier layer is adhered to the middle layer. The method includes applying a multilayer tape system to a surface and removing the outer carrier layer to expose a preselected gap width. The multilayer tape system includes an inner layer, at least one middle layer, and an outer carrier layer.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

A dicing die bonding film according to the present invention includes: a dicing tape including a base layer and an adhesive layer laminated on the base layer; and a die bonding layer laminated on the adhesive layer of the deicing tape; the die bonding layer including a matrix resin, a thiol-group-containing compound, and conductive particles.

The present invention relates to an adhesive sheet made of a fiber material, and a method for manufacturing same, the sticky adhesive mesh comprising mesh fabric, an ink layer printed on the upper surface of the mesh fabric, a first adhesive layer coated on the lower surface of the mesh fabric, an absorption layer stacked on the lower surface of the first adhesive layer, a second adhesive layer coated on the lower surface of the absorption layer, and release paper stacked on the lower surface of the second adhesive layer, wherein the mesh fabric is made of fabric woven by crossing wefts and warps and is formed to be porous by having gaps between the wefts and the warps, the first adhesive layer is formed to have a plurality of adhesive layers that are repeatedly coated to be stacked.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Provided is a multilayer adhesive tape having excellent step coverage and reworkability. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which the intermediate adhesive layer includes an intermediate adhesive polymer including: a polymerization unit of an alkyl group-containing (meth)acrylate monomer; a polymerization unit of a carboxyl group-containing monomer; and a polymerization unit of an acrylamide-based monomer.

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

A multilayer adhesive film is provided including: a first outer adhesive layer; a second outer adhesive layer; and an intermediate adhesive layer disposed between the first outer adhesive layer and the second outer adhesive layer. The multilayer adhesive film has both high step absorbency and excellent reworkability.