The present invention provides an optically clear adhesive sheet that has excellent flexibility and prevents delay bubbles in high temperature and high humidity environments. The optically clear adhesive sheet of the present invention sequentially includes a first surface-adhesive layer, an intermediate adhesive layer, and a second surface-adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a higher storage elastic modulus at 85° C. than the intermediate adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a storage elastic modulus at 85° C. of 3.0×10.sup.4 Pa or higher and 30.0×10.sup.4 Pa or lower. The intermediate adhesive layer has a storage elastic modulus at 85° C. of 1.0×10.sup.4 Pa or higher and 15.0×10.sup.4 Pa or lower. The intermediate adhesive layer contains polyurethane.

A tape closure system is shown and described herein. The tape closure system includes a first tape component having a pressure sensitive adhesive and a second tape component having a pressure sensitive adhesive, where at least one of the pressure sensitive adhesives has a modified surface to reduce the tack of the surface such that when the first and second pressure adhesives are brought into contact with one another they may sufficiently adhere to one another to form a seal but are still separable from one another and able to be repeatedly opened and sealed. Such a tape may be manufactured through high speed manufacturing processes and wound into large master rolls. In the roll configuration, the modified surface contacts the backside of the liner and experiences compressive forces in the roll. Due to the compressive forces, a part of the modified surface may get pushed into the PSA, thereby affecting the properties of the modified adhesive. An embodiment of this invention provides an embossed liner with spacers that nest the modified adhesive surface when it is self-wound, thereby preventing the deterioration of the adhesive properties. An embodiment of the invention is a method by which the adhesive-based closure system can be applied on to a flexible packaging material on a Form Fill Seal packaging machine in one of three ways: (1) In a form of a tape from a spool. (2) In a form of an adhesive dispensed directly on to flexible packaging material. (3) In form of a tape dispensed from a roll of pressure sensitive adhesive roll. Another embodiment of the invention is a double sided tape with the detack layer on both sides. An embodiment of the present invention can also be used for temporary closure with no damage done to the underlying system.

A double sided adhesive masking Tape used for several applications involving Auto Body painting. This tape can be used from the preparation of the vehicle which includes priming, to the final stage which is the complete paint job.

The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate may be coupled to a second substrate by a composite joint between the first substrate and the second substrate. The composite joint may be comprised of a first adhesive material and a second adhesive material. The first adhesive material may be disposed on the first substrate, and the second adhesive material may be disposed to the first adhesive material. The composite joint between the first substrate and the second substrate may provide an isolation layer therebetween, preventing galvanic corrosion.

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.

The invention relates to an adhesive tape, comprising at least one layer of a first, heat-curable adhesive material and, on one of the surfaces of the heat-curable adhesive material layer, a layer of a second, pressure-sensitive adhesive material, characterized in that the second, pressure-sensitive adhesive material is based on one or more unvulcanized rubbers having a saturated carbon chain of the polymethylene type.

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

A sealing device including a waterproofing membrane, a sealant layer covering at least a portion of the second primary exterior surface of the waterproofing membrane and an adhesive layer covering a portion of the outer major surface of the sealant layer facing away from the second primary exterior surface of the waterproofing membrane, wherein the sealant layer is composed of an adhesive sealant composition comprising at least one elastomer, at least one at 25° C. liquid polyolefin resin, and at least one inert mineral filler. A method produces a sealing device, a method waterproofs a substrate, and a waterproofed substrate.

Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

The present invention is a multi-layer optically clear adhesive construction having at least one adhesive slip layer. Exemplary constructions comprise an adhesive core layer and at least one slip layer. The slip layer provides enhanced reworkability of the final assembly and also alleviates bonding process induced stress. The slip layer is represented by a curable adhesive layer having a tan delta of at least 0.8 at a temperature of 100° C. at 1 Hz. The adhesives described herein may be used in display assemblies to provide optical and mechanical coupling of substrates in the device.