Patent classifications
C09J2301/208
Packaging material for power storage devices, and method of producing packaging material for power storage devices
The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.
ADHESIVE SHEET
A pressure sensitive adhesive surface that does not adhere to the adherend and can be positioned by sliding it under low pressure, while it can exert a sufficient adhesive force under a pressure above a certain level. The adhesive sheet includes an adhesive layer with a fine structure on a surface thereof. The fine structure includes a plurality of cone or frustum structures, with the cones or frustums having two or more parts joined to each other via an interface. A first part is present on a top of the cones or frustums and is formed from a non-adhesive or a weak adhesive material, and a second part is present below the first part and is formed from a strong adhesive material.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, HEAT-CURABLE RESIN COMPOSITION, AND DICING-DIE ATTACH FILM
A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.
PROFILED PROTECTIVE TAPE FOR ROTOR BLADES OF WIND TURBINE GENERATORS
A multilayer protective tape for rotor blades of wind energy turbines is provided herein. The protective tape comprising a protective top layer comprising a polymer film, and an adhesive bottom layer. The top layer having a continuous surface (S) that is outwardly curved or outwardly trapezoidal such that the tape has a cross-sectional profile having an inner section between first and second edge lateral sections. The inner section comprises up to 30% of the width of the tape and has a thickness (Ti), while the first and second edge lateral sections have a thickness of T1 and T2, respectively, wherein Ti greater than each of T1 or T2, and the thickness (T1 or T2) of at least one edged lateral section is at most 600 μm and the thickness of the inner section (Ti) is at least 330 μm.
Also provided is a method for applying the tape to rotor blades and a rotor blade protected by said protective tape.
ADHESIVE TAPE THAT CAN BE WOUND AND STAMPED FOR SELECTIVE UV ACTIVATION
An adhesive tape 10 that can be wound and stamped for selective UV activation, comprising at least a first UV activatable adhesive compound 1 on an epoxide basis and a carrier 2, the carrier being UV intransparent, for providing selective UV activatability of the adhesive tape 10.
Drywall joint tape with dual purpose adhesive backing
A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form a secure bond with the wallboard panels.
Sandwich Panel And A Manufacturing Method Thereof
The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.
Adhesive member, display device including the same and method of manufacturing the same
An adhesive member for a display device is disclosed. The adhesive member may include an adhesive film configured to roll along a rolling axis. The adhesive film may include an adhesive portion including a plurality of adhesive lines. The plurality of adhesive lines may not be orthogonal to the rolling axis.
GEL GASKET
The present disclosure provides a gel gasket comprised, in part, of a pressure sensitive adhesive. The gel gasket is flame retardant and has anti-corrosive properties. In at least one embodiment, the gel gasket has a storage modulus of about 1,000 to about 25,000 Pa and the storage modulus is maintained after storage at 66° C./80% RH for at least 2 weeks.
ADHESIVE FILM FOR METAL TERMINAL, METAL TERMINAL WITH ADHESIVE FILM, AND BATTERY
This adhesive film for a metal terminal is interposed between a metal terminal electrically connected to an electrode of a battery element and a wrapping material sealing the battery element and is provided with at least one resin layer having a polyolefin backbone. When the adhesive film for the metal terminal is measured with a differential scanning calorimeter, a melting peak is observed within the range of 120° C. to 156° C.