Transaction and proximity cards having an improved construction and systems for utilizing such cards. The card system includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply. In one card embodiment, the card further includes at least one inlay between the only one top ply and the only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply and the at least one inlay. In addition, the transaction card system includes card dispensers adapted to dispense the cards.

Provided is a laminate for an electrochemical device that can advantageously be used as a device member having excellent low-temperature adhesiveness and blocking resistance. The laminate includes a functional layer containing heat-resistant fine particles and adhesive particles and a substrate. The adhesive particles contain an adhesive polymer that includes an aromatic vinyl monomer unit and a wax that has a melting point of lower than 95° C. In plan view of the laminate from a side corresponding to the functional layer, the functional layer includes an adhesion region formed of the adhesive particles and a heat-resistant region formed of the heat-resistant fine particles. The volume-average particle diameter of the adhesive particles is larger than the average stacking direction height of the heat-resistant region.

The present disclosure provides a hot melt tape at least including a substrate, an adhesive layer, and an anti-sticking layer, wherein the anti-sticking layer is adjacent to the adhesive layer and is the outermost layer of the hot melt tape. The hot melt tape may be used to seal objects, and preferably is made of a multilayer co-extrusion process. The anti-sticking layer prevents the hot melt tape from sticking the objects without needing a release film, and the hot melt tape can be directly heated during sealing the objects.

The present disclosure relates to an elastic hot glue having low processing temperature capability. The elastic hot glue includes a TPU glue layer. The melting point of the TPU glue layer is 60˜100° C. The elastic recovery rate of the TPU glue layer is 95-100%. The elastic hot glue of the present disclosure can be widely applied to low processing temperature. The product using the elastic hot glue of the present disclosure has high elasticity recovery, and strong peeling strength so as to avoid the damage of the product, and increase the life of the product and maintain the appearance of the product.

A polyurethane hot melt adhesive is provided. The polyurethane hot melt adhesive is formed by reacting an isocyanate component, a polyol component, and a chain extender component. The polyol component includes a first polyol and a second polyol, a number-average molecular weight of the first polyol is within a range from 650 to 1,500, and a number-average molecular weight of the second polyol is within a range from 1,500 to 3,000. The chain extender component includes a first chain extender and a second chain extender, and the second chain extender is a diyol having an ether group or a hydrocarbyl. A ratio between a weight percentage of the first chain extender and a weight percentage of the second chain extender is within a range from 9:1 to 4:1. A forming temperature of the polyurethane hot melt adhesive is within a range from 100° C. to 150° C.

The invention relates to a thermally activatable reactive adhesive film comprising a carrier film made of thermoplastic polyurethane, which is coated on at least one side with a latently reactive, thermally activatable adhesive compound.

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.

A heat-sensitive label that can achieve both sufficient adhesive strength and high recyclability is provided. A heat-sensitive label comprising a substrate layer and a heat sealing layer (A) on the substrate layer, wherein the heat sealing layer (A) comprises a heat sealing resin and a carboxylic anhydride-modified polyolefin resin (h); and a product MCh of an acid value M (mgKOH/g) of the carboxylic anhydride-modified polyolefin resin (h) and a content Ch (% by mass) of the carboxylic anhydride-modified polyolefin resin (h) in the heat sealing layer (A) is 1.5 to 6.0.

The invention is related to a method for bonding components of a PEM fuel cell with a frame and/or amongst one another, wherefore an adhesive curable by electromagnetic radiation in the range of visible light or UV is applied to the frame and/or the at least one component. The invention is characterized in that the adhesive is activated by the electromagnetic radiation and heated after the frame and/or components are brought into contact; or the frame and/or the components are brought into contact and the adhesive is exposed to electromagnetic radiation for activating and heating; to reduce its viscosity before the adhesive is finally cured. The adhesive is a cationic epoxy which contains water.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.