Patent classifications
C09J2301/304
THERMOSETTING ADHESIVE SHEET AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.
Laminate for battery
A laminate for a battery with a polypropylene adhesive layer and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene-α-olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130° C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100° C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.
ANISOTROPIC CONDUCTIVE FILM, MANUFACTURING METHOD THEREOF, AND CONNECTION STRUCTURE
An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.
HOT MELT ADHESIVE SHEET
A hot melt adhesive sheet according to the present invention is a hot melt adhesive sheet including a base material having at least one surface on which an adhesive layer made of a hot melt adhesive is disposed. The hot melt adhesive includes a crosslinked product of an adhesive composition including a crosslinking agent, and includes a polyurethane resin, an epoxy resin, an isocyanate-based crosslinking agent, and a crystalline polyester resin. The epoxy resin includes a bisphenol A type epoxy resin and a rubber-modified epoxy resin. The crystalline polyester resin has a number average molecular weight Mn of 33,000 or less, and a glass transition temperature Tg of 5 C. or less. The isocyanate-based crosslinking agent is included in an amount of 14 mass parts or less based on 100 mass parts of a total of the polyurethane resin and the crystalline polyester resin.
SEAL FOR BAG FOR CONTAINING A BALE OF COMPRESSIBLE MATERIAL, SEALING PATCH AND METHOD OF SEALING
A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.
COMPOSITE HOT-MELT ADHESIVE NET FILM AND MANUFACTURING PROCESS THEREOF
A composite hot-melt adhesive mesh film and preparation process thereof, in particular, a composite hot-melt adhesive mesh film and preparation process thereof for bonding metal and non-polar material are disclosed. The mesh film is compounded of a polar polyamide hot-melt adhesive and a non-polar polyolefin hot-melt adhesive mesh film containing a compatibilizer. The mesh film has a high adhesive strength and a durable and stable adhesion, and is especially suitable for bonding stainless steel, aluminum, copper or other metal materials and polyethylene, polypropylene or other non-polar polymers. Additionally, the preparation process is completed in one set of production process from raw material pretreatment to the final preparation of the hot melt adhesive mesh film product, thereby greatly reducing production failures, and providing high production efficiency and low costs.
SHEET ADHESIVE AND ADHESION PROCESS USING THE SAME
It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application.
A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.014 by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.
SEAM TAPE AND RELATED METHODS AND PRODUCTS
A polyolefin-containing seam tape is described herein. The polyolefin may be at least one of a homopolymer, copolymer, terpolymer, or a polymer blend of polyethylene, polypropylene, or a combination of the two. The seam tape may be used to form a bonded, reinforced, or waterproofed seam. The seam tape may be used in equipment or apparel that may or may not be recyclable.
Adhesive compositions and methods
The present invention encompasses polyurethane adhesive compositions comprising aliphatic polycarbonate chains. In one aspect, the present invention encompasses polyurethane adhesives derived from aliphatic polycarbonate polyols and polyisocyanates wherein the polyol chains contain a primary repeating unit having a structure:. In another aspect, the invention provides articles comprising the inventive polyurethane compositions as well as methods of making such compositions.
DOUBLE-SIDED TAPE FOR FIXING ELECTRODE CONSTITUENT BODY, AND SECONDARY BATTERY
The double-sided tape for fixing an electrode constituent body is used in an electrochemical device that houses in a pouch-type outer casing an electrode constituent body wherein a positive electrode member, a separator member and a negative electrode member are layered or wound. The double-sided tape comprises a surface having a pressure-sensitive adhesive for adhering to the electrode constituent body, and a surface having a heat-sensitive adhesive for adhering to the pouch-type outer casing.