Pressure sensitive adhesives and tapes having flame-retardant properties include a substrate layer and a layer of pressure sensitive adhesive disposed on the substrate layer. The pressure sensitive adhesive is a UV-cured composition of a curable composition. The curable composition includes a polymerizable (meth)acrylate-based mixture, a polymerizable aromatic (meth)acrylate oligomer, a liquid flame retarding agent, and at least one UV initiator. The UV-cured composition is an optically clear pressure sensitive adhesive with flame retarding properties.

The present invention provides a surface protective film which includes an adhesive layer on one surface of a substrate film, wherein the adhesive layer is a cured product of a composition containing: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a peel strength adjusting agent; and a photoinitiator, the composition being solvent-free; and the adhesive layer has peel strength of 0.5 gf/in to 10 gf/in, as measured on glass at a peel angle of 180° and a peel rate of 1.8 m/min.

Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.

The present invention relates to an adhesive tape having a layer structure in which an adhesive layer, a first film layer (I), a base material layer, and a second film layer (II) are arranged in this order, in which the base material layer satisfies a predetermined requirement that a ratio (a)/(b) of a thickness (a) to a thickness (b) is not less than 1.7 or not more than 0.6 in which the thickness (a) is a thickness from the first film layer (I)-side of the base material layer to the outer surface of the adhesive layer and the thickness (b) is a thickness from the second film layer (II)-side surface of the base material layer to the outer surface of the second film layer (II), and at least one layer constituting the layer structure contains a flame retardant (C).

A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole;

removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller;
transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric;
bonding the foam and the fabric by compressing; and
cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

The present invention is concerned with the use of hydrotreated synthetic Fischer-Tropsch waxes in polyolefin-based hot melt adhesive compositions, wherein the hydrotreated synthetic Fischer-Tropsch waxes modify the color degradation in the polyolefin-based hot melt adhesive compositions and are characterized by a polydispersity between 1.02 and 1.06.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The purpose of the present invention is to provide a double-sided adhesive film which has a generally equal elongation in the XY (longitudinal and transverse) directions, more preferably in the thickness direction, while being prevented from the occurrence of adhesive protrusion or glue burr, and which has higher adhesive force and higher holding power in comparison to similar single-layer adhesive articles, while being applicable to a stretchable or flexible adherend. A double-sided adhesive film according to the present invention is a substrate-less double-sided adhesive film which is composed of a center layer that is formed of a resin adhesive, and adhesive layers that are superposed on the front surface and the back surface of the center layer, said adhesive layers being formed of a resin that is the same as or similar to the resin that constitutes the center layer, wherein the weight average molecular weight or the crosslinking degree of the resin that constitutes the center layer is higher than the weight average molecular weight or the crosslinking degree of the resin that constitutes the adhesive layers. This double-sided adhesive film is characterized in that the tolerance between the elongation in the longitudinal direction and the elongation in the transverse direction is ±20% or less relative to one of the elongations, more preferably, the elongation in the longitudinal direction and the elongation in the transverse direction are equal to each other.

A structure has a flexible thermally conductive material having an adhesive surface and a non-adhesive surface, and a thermally conductive adhesive adhered to the adhesive surface of the flexible thermally conductive material leaving the non-adhesive surface exposed to an atmosphere in which the structure resides. A structure has a substrate having one or more conductive paths, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the conductive paths. An apparatus has a substrate having one or more conductive paths, a probe tip at one end of the substrate configured to electronically connect with a device under test, and a flexible, thermally conductive material attached to at least a portion of the substrate to draw heat away from the probe tip and conductive paths.