A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

A foaming adhesive sheet comprising a substrate and an adhesive layer placed on at least one surface side of the substrate; wherein the adhesive layer includes a curable adhesive, and a foaming agent; and a peeling force of a surface side where the adhesive layer is placed, measured by SAICAS (Surface And Interfacial Cutting Analysis System) method is 2.0 N or more.

An adhesive composition degradable by dielectric heating. The adhesive composition comprises a thermosetting polymer and a material sensitive to dielectric heating. The material sensitive to dielectric heating is selected from any one or more of hollow nanospheres, nanotubes, nanorods, nanofibres, nanosheets, graphene, graphene derivatives, nano/micro hybrids and mixtures of two or more nanoscale particles. The adhesive composition may be particularly useful in the assembly and disassembly of parts, particularly parts which have complicated and/or blocked joined surfaces. A method of joining at least two parts of an article together and a method of disassembling at least two parts of an article, using the adhesive composition are also provided. The adhesive composition may provide a reworkable nano-composite adhesive. The adhesive composition may be used to reversibly bond a biomedical or dental implant to a part of a human or animal body.

The invention relates to the use of a separating medium, containing at least one essential oil or consisting of at least one essential oil, selected from the group consisting of phenols, phenylpropanoids and furanocoumarins, for separating at least two joining parts which are joined by means of an adhesive bond.

The present invention provides, in at least one embodiment, a film and method for engraving objects. The film includes an adhesive layer configured to allow the film to be easily repositionable on the surface of an object. For example, the film can be shifted, rotated, or moved prior to pressure being applied and before the engraving. Additionally, the photoresist layer includes microspheres comprising small pockets of air which strengthen the photoresist layer by bouncing the engraving blast away and allow the photoresist layer to advantageously be designed thinner.

Water-based adhesive compositions are improved by the incorporation of hollow polymeric microspheres having outer surfaces coated with one or more barrier materials such as calcium carbonate particles. The adhesive compositions exhibit enhanced rheology, sprayability, drying time, tack and storage stability as compared to analogous adhesives that are not modified with coated hollow polymeric microspheres. Such compositions are useful as both contact adhesives as well as wet bonding one-way adhesives.

There is provided retroreflective articles comprising a binder layer comprising an adhesive composition comprising at least one tackifier and at least one elastomer selected from at least one of natural rubbers and synthetic rubbers, and a layer of optical elements at least partially embedded in a major surface of the binder layer. There are also provided articles of clothing using the presently disclosed retroreflective articles and methods for preparing the retroreflective articles.

Provided is a method of manufacturing an electronic part including fixing a hard and brittle substrate to a support and separating the hard and brittle substrate from the support, the method being capable of preventing the hard and brittle substrate from being damaged during the separation of the hard and brittle substrate from the support. The method of manufacturing an electronic part of the present invention is a method of manufacturing an electronic part including processing a workpiece fixed onto a support, the method including: fixing the workpiece by arranging at least one heat-peelable layer between the support and the workpiece; processing a surface of the fixed workpiece on an opposite side to the heat-peelable layer; and separating the workpiece from the support by heating the heat-peelable layer after the processing.

The present invention relates to an adhesive tape comprising at least one carrier that has a thickness of 20 to 250 μm, preferably 50 to 150 μm, and has at least one layer (i) based on preferably uncrosslinked thermoplastic polyurethane that has been produced by means of extrusion, wherein the polyurethane is based on aromatic polyisocyanate, such as aromatic diisocyanate in particular, or (ii) based on preferably uncrosslinked polyurethane that has been produced from a dispersion, wherein a pressure-sensitive adhesive layer is disposed on at least one side, preferably both sides, of the carrier. The invention also relates to processes for producing the adhesive tape and to the use thereof for bonding of components in electrical, electronic, optical or precision mechanical devices, such as, in particular, of windows or lenses in housings of precision mechanical, optical and/or electronic devices.

The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.