There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

The present disclosure relates to a red LED chip component, a red LED chip, a display panel and a manufacturing method. The red LED chip component includes an insulating substrate and a plurality of red LED chips arranged on the insulating substrate. The red LED chip and the insulating substrate are bonded by a thermal release adhesive layer.

The present invention provides a filament-bearing tape. The filament-bearing tape extends longitudinally and comprises a flexible substrate having a first edge and a second edge parallel to the first edge, and having top and bottom surfaces. The tape also has a filament that is encompassed in the top surface of the substrate, parallel to the edges of the substrate.

A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.

The present disclosure relates to a silicone composition for use as a temporary bonding adhesive comprising: (A) a polydiorganosiloxane having at least two alkenyl groups in each molecule; (B) a polyorganosiloxane having at least one silicon-bonded hydrogen atom in each molecule; and (C) a thermally expandable powder having an expansion ratio of 10 or more.

Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):

Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116  (1).

In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.

A polymeric material comprising from about 5% to about 60% of a Diels-Alder additive, wherein the additive crosslinks at a temperature below 100° C., an adhesive or sealant component, wherein the viscosity of the adhesive or sealant is reduced by at least about 5%, at least about 30%, at least about 80%, or even at least about 100% when combined with the Diels-Alder additive.

An acrylic emulsion pressure-sensitive adhesive composition is provided. More particularly, an acrylic emulsion pressure-sensitive adhesive composition that may become easily removable when being impregnated with water in a water-borne removal process while being able to realize excellent tacky/adhesive strength for a substrate to be adhered is provided.

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

The specification relates to a density adjustable label and a label laminate (8) for providing the same. Further, the specification concerns a combination of a label (1) and an item (100), as well as a method for manufacturing the label laminate (8). The label (1) comprises a face layer (2) and an adhesive layer (4). The face layer (2) comprises natural fibre based material. The adhesive layer (4) comprises pressure sensitive adhesive and at least one additive for adjusting total density of the label. The pressure sensitive adhesive comprises acrylic polymer(s). The additive comprises expandable particles, the label is detachable from a surface labelled at washing conditions having temperature in a range of 60-90° C. or above and the detached label is arranged to float on a washing liquid.