A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

To provide a double-sided adhesive tape that achieves both high adhesive force and excellent easy disassembly properties. The double-sided adhesive tape includes a first adhesive layer; an intermediate layer provided on the first adhesive layer and containing a pigment and a binder resin; a film-like substrate stacked directly on the intermediate layer; and a second adhesive layer provided on the film-like substrate, in which the content of the pigment is from 1 to 85 wt % based on the total mass of the intermediate layer.

The present invention is a method for controlling flatness of a wafer including the steps of: providing a holding member having a holding surface including a plurality of segments, where each of the plurality of segments includes a dry adhesive fiber structure; making the holding surface of the holding member adhere to a wafer to make the holding member hold the wafer; obtaining information on flatness of the wafer by measuring flatness of the wafer to; and releasing adhesion of the dry adhesive fiber structures to the wafer in a part of the plurality of segments of the holding surface of the holding member based on the information on flatness. This can provide: a method for controlling flatness by which flatness of a wafer can be controlled sufficiently.

A label which is attachable to object surfaces includes a pressure sensitive adhesive layer having a coat weight equal to or higher than 10 g/m.sup.2. The adhesive layer has a composition which is free of alkylphenol ethoxylate and has been selected to comprise emulsion polymerized, water-dispersible acrylate polymer and non-ionic copolymer based on polyethylene glycol and polypropylene glycol such that when the adhesive layer is subjected to paper recycling process conditions, the adhesive layer resists disintegration into small fragments.

Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100° C. and 150° C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.

The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.

Primer for producing a partable adhesive bond, the primer being based on a pressure-sensitive adhesive which comprises a chemical or physical blowing agent.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

The invention relates to on-demand debondable pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesives and laminating adhesives are applied onto a substrate to form a bond, and upon exposure to electron beam or UV light energy source, the adhesive can dissociate from the substrate. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recycling in a circular economy.

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.