A heat-resistant weld backing tape for placement between a backing member and a workpiece to be welded at a root gap. The weld backing tape includes a flexible tape substrate. The tape substrate has a longitudinal length that extends between first and second tape substrate ends, and a lateral width that extends between first and second tape substrate side edges. The tape substrate has a substantially planar first face and a substantially planar second face. The first and second tape substrate faces are mutually parallel and spaced from each other by a tape substrate thickness. The tape substrate length and the tape substrate width are substantially larger than the tape substrate thickness. A heat-resistant material is disposed on the first tape substrate face and arranged to face the workpiece during welding. An adhesive material is disposed on the second tape substrate face and arranged to face the backing member during welding.

An adhesive composition may include at least about 2 wt. % and not greater than 49 wt. % of a (meth)acrylic based polymeric component A for a total weight of the adhesive composition, at least about 51 wt. % of a (meth)acrylic based polymeric component B for a total weight of the adhesive composition, and at least about 0.1 wt. % and not greater than about 30 wt. % of a tackifier component for a total weight of the adhesive composition. The (meth)acrylic based polymeric component A may have a glass transition temperature (Tg) of at least about 40 C. The (meth)acrylic based polymeric component B may have a glass transition temperature (Tg) of not greater than about 20 C. Further, the (meth)acrylic based polymeric component B may be acid-free.

An adhesive may include an adhesive structure and an adhesive composition. The adhesive structure may include a graft copolymer. The adhesive composition may include at least about 1 wt. % and not greater than 40 wt. % of a macromonomer component for a total weight of the adhesive composition, at least about 50 wt. % and not greater than about 98 wt. % of a (meth)acrylic based polymeric component A for a total weight of the adhesive composition, and at least about 0.1 wt. % and not greater than about 30 wt. % of a tackifier component for a total weight of the adhesive composition. The macromonomer component may have a weight-average molecular weight of at least 1000 g/mol and a glass transition temperature (Tg) of at least about 40 C. The (meth)acrylic based polymeric component A may have a glass transition temperature (Tg) of not greater than about 20 C.

Various embodiments relate to classifying comparators based on comparator offsets. A method may include applying, via a strobe, a first voltage to each of a first input and a second input of a comparator to generate a number of output signals from the comparator, wherein each output signal has one of a first polarity and a second polarity. The method may further include in response to each of the number of output signals being the first polarity, applying, via a strobe, an external offset voltage having the second polarity to the comparator to generate a second number of output signals. Further, the method may include in response to each of the second number of output signals being the same polarity, identifying the comparator as a reliable comparator.

A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the first and second materials upon curing of the nanocomposite adhesive, and the RF electromagnetic wave has a frequency in the radio-frequency range, having energy that is transferred to the nanoheater elements by electromagnetic wave interactions with permanent and induced dipoles, intrinsic photon-phonon interaction, or interactions with nanoheater defects and grain structures.

A waterproofing membrane system for waterproofing a concrete substrate is disclosed. The waterproofing membrane may comprise a first layer comprising a thermoplastic elastomeric waterproof material using advanced polymerization and squeeze technology. The second layer may comprise a carrier sheet that comprises a fabric. The third layer may comprise an adhesive to provide bonding of the first layer with a concrete substrate upon contact. In addition, the third layer may reduce migration of water and vapor traveling between the first layer and the concrete substrate. In some examples, the waterproofing membrane may also comprise a fourth layer to provide mechanical protection and ease of handling for the first layer, the second layer, and the third layer. In some examples, the first layer may comprise a thermoplastic polyolefin (TPO), the fabric may comprise polypropylene and/or polyethylene, the adhesive may comprise a C5 petroleum resin, and the fourth layer may be a protective coating comprising quartz sand (SiO2) having a reflectivity of 4.5%.

A waterproofing membrane system for waterproofing a concrete substrate is disclosed. The waterproofing membrane may comprise a first layer comprising a thermoplastic elastomeric waterproof material using advanced polymerization and squeeze technology. The second layer may comprise a carrier sheet that comprises a fabric. The third layer may comprise an adhesive to provide bonding of the first layer with a concrete substrate upon contact. In addition, the third layer may reduce migration of water and vapor traveling between the first layer and the concrete substrate. In some examples, the waterproofing membrane may also comprise a fourth layer to provide mechanical protection and ease of handling for the first layer, the second layer, and the third layer. In some examples, the first layer may comprise a thermoplastic polyolefin (TPO), the fabric may comprise polypropylene and/or polyethylene, the adhesive may comprise a C5 petroleum resin, and the fourth layer may be a protective coating comprising quartz sand (SiO2) having a reflectivity of 4.5%.

Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (m) of the pressure-sensitive adhesive layer and a creep characteristic (m/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (m)).sup.2creep characteristic (m/Hr)5010.sup.3 (m.sup.2.Math.m/Hr).

Provided is a reactivatable tile bonding mat installable without cement-based thinset. The reactivatable tile bonding mat may include a top surface and a bottom surface. The top surface and the bottom surface include a polymer hot-melt material. The polymer hot-melt material can be reactivatable by heating. The polymer hot-melt material can be adhesive with regard to a surface of at least one of concrete, wood, stone, tile and vinyl. The polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature. The polymer hot-melt material can be heated by convection heating. The polymer hot-melt material comprises a polyethylene terephthalate (PET) and a filler. The filler can include at least one of calcium carbonate, aragonite, silica, metal flake, and glass. The PET and the filler are mixed in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature.

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles.