A photocurable silicone composition, containing: (A) an organopolysiloxane having at least one specific structure having a (meth)acryl group in the molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (C) a photo-radical polymerization initiator; and (D) a platinum-group metal catalyst to be activated by light having a wavelength of 200 to 500 nm. The photocurable silicone composition has good storability, and good surface curability and deep-part curability in the air; an adhesive consisting of this photocurable silicone composition; and a cured material of this photocurable silicone composition.

The present invention relates to a ferroelectric adhesive composition comprising from 2 to 50% of an adhesive matrix, from 5 to 85% of a ferroelectric component, wherein all weight percentages are based on weight of the total weight of the composition, and wherein said ferroelectric component is in a ferroelectric phase. The ferroelectric adhesive composition according to the present invention can be used as a sensor, an emitter or as a generator in an energy harvester. Furthermore, the present invention also encompasses a device comprising a ferroelectric adhesive composition according to the present invention between two conductive elements.

Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.

A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings are connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.

Provided are metal particles for an adhesive paste, a solder paste composition including the same, and a method of preparing the metal particles for an adhesive paste. The metal particles for an adhesive paste may include a core including one or more metal materials; and a shell arranged on part or an entirety of the core and including one or more metal materials. The metal material of the core may have a melting point higher than that of the metal material of the shell. An intermetallic compound is capable of being formed between the metal material of the core and the metal material of the shell. A ratio (D90/D10) of the 90% cumulative mass particle size distribution (D90 size) to the 10% cumulative mass particle size distribution (D10 size) in a particle size distribution of the metal particles may be 1.22 or less.

Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to difficult-to-adhere to base materials, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A1) an organopolysiloxane resin having no hot-melt properties as a whole molecule and contains 20 mol % or more of a siloxane unit represented by SiO.sub.4/2, (A2) a liquid chain organopolysiloxane having at least two curing-reactive functional groups in the molecule, (B) a silatrane derivative or carbasilatrane derivative, (C) a curing agent, and (D) a functional inorganic filler. The content of component (D) is at least 10% by volume. The composition has hot-melt properties at a temperature of 200° C. or lower.

A multilayer base designed to be bonded to the skin so as to form a prosthesis for self-adhesive hair, comprising an acrylic film with the addition of 0.1 to 3% of silver ions having the shape of the crown of the user's cranium and a polyurethane membrane onto which the hair is grafted attached to said acrylic film, characterized in that 0.1 to 3% by weight of micronized silver powder, 0.1 to 3% of nano-bio-ceramics and 0.1 to 3% of maslinic acid are added to the polyurethane polymer forming the membrane onto which the hair is grafted.

A two-component composition including a first component A including an aqueous dispersion of at least one polymer P, at least one metal salt M, and at least one liquid organic freeze point depressant D, and a second component B having a mineral binder composition C having at least one hydraulic binder H. The two-component composition is used as an adhesive, sealant or coating and to a method for bonding a first substrate to a second substrate.

A bonding and sealing material includes, as the essential ingredients, a solder powder, silver nanoparticles coated with a coating material and a solvent, and additionally includes at least one ingredient selected from the group consisting of selenium metal, oxide film inhibitors and oxide film removers. This bonding and sealing material can easily form under mild conditions a metallic adhesive layer having good hermetic sealability and UV resistance of the sort desired when sealing a short-wavelength light-emitting device such as a UV-LED, and can be stably used over a long period of time.

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.