One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.

An article is provided. The article includes an acrylate layer; a substrate overlaying the acrylate layer; and an adhesive layer between the acrylate layer and the substrate, wherein the adhesive layer includes germanium; wherein a release value between the acrylate layer and the adhesive layer is more than 200 g/inch.

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles.

Provided are an adhesive film, an optical member comprising same, and an optical display device comprising same, the adhesive film comprising a (meth)acryl-based binder containing an aromatic group and a hydroxyl group, inorganic particles, and a trigger polymer, wherein the trigger polymer has a melting point of about 0° C. or more, the adhesive film has a haze of about 2% or less, and an adhesive film has a ratio of adhesive strength of about 10 or more according to Equation 1.

An adhesive/sealant material for induction heating including copolymer of ethylene and butyl acrylate and a metallic filler. The metallic filler may be present in an amount of at least about 30% by weight of the adhesive/sealant material.

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

Provided are an adhesive sheet including an adhesive layer that contains a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more, and has a thickness variation of less than 10%, and an electronic component including an adhesive layer that contains a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more, and has a thickness variation of less than 10%.

A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings are connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.