The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

The present invention discloses flip-chip bonding method using an anisotropic adhesive polymer. The method includes applying an adhesive polymer solution containing metal particles dispersed therein onto a circuit substrate to form an adhesive polymer layer such that the adhesive polymer layer covers the metal particles; drying the adhesive polymer layer; and positioning an electronic element to be electrically connected to the circuit substrate on the dried adhesive polymer layer and causing dewetting of the polymer from the metal particles.

A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the first and second materials upon curing of the nanocomposite adhesive, and the RF electromagnetic wave has a frequency in the radio-frequency range, having energy that is transferred to the nanoheater elements by electromagnetic wave interactions with permanent and induced dipoles, intrinsic photon-phonon interaction, or interactions with nanoheater defects and grain structures.

A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other, and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings am connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.

Various opacifying adhesive compositions are described. The adhesives exhibit relatively high levels of opacity in wet conditions while maintaining acceptable adhesive properties. Also described are label assemblies and labeled containers using such adhesives. Related methods of use and preparation are also described.

A sealing device includes a waterproofing membrane, an adhesive sealant layer, and optionally a release liner, wherein the adhesive sealant layer includes at least one elastomer, at least one at 25° C. liquid polyolefin resin, and at least one inert mineral filler. An adhesive sealant composition is used to form the adhesive sealant layer. The sealant device may be used to waterproof a substrate and provide a fully-adhered roof system. The adhesive sealant composition may be used to provide a self-healing roofing membrane.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 40% by mass and less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A method for making an oil- and water-resistant nanocomposite material includes preparing F-doped TiO.sub.2 nanorods, dispersing the F-doped TiO.sub.2 nanorods into a transparent adhesive to obtain a nanocomposite adhesive, and treating a surface of the nanocomposite adhesive to roughen the surface and expose some of the F-doped TiO.sub.2 nanorods. A transparent nanocomposite material suitable for use as transparent packaging for example is thereby obtained. The present disclosure also provides the nanocomposite material, and an encapsulating structure using the nanocomposite material.

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Various opacifying adhesive compositions are described. The adhesives exhibit relatively high levels of opacity in wet conditions while maintaining acceptable adhesive properties. Also described are label assemblies and labeled containers using such adhesives. Related methods of use and preparation are also described.