The present application relates to a method for manufacturing a foldable backplate film, and according to one aspect of the present invention, a method for manufacturing a foldable backplate film that the foldable backplate film is manufactured by a method of cutting it in a direction from the release film to the protective film upon half-cutting, and then release-changing the release film, whereby by improving a half-cutting process, the foldable backplate does not fall off upon the release film peeling, is provided.

A pressure sensitive adhesive sheet is provided which comprises a base material having insulation properties, an inorganic filler-containing resin layer provided at least at one side of the base material and containing an insulating inorganic filler, and a pressure sensitive adhesive layer provided as an outermost layer of at least one surface. According to such a pressure sensitive adhesive sheet, insulation properties can be ensured even when the base material undergoes carbonization and/or combustion/decomposition due to high temperatures and insulation breakdown occurs in the base material.

The present invention provides a window film, a manufacturing method thereof, and a display device including the same. The window film comprises: a basic material layer; a window coating layer formed on one surface of the basic material layer; and a back coating layer formed on the other surface of the basic material layer, wherein the window film has a relation of formula 1.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.

Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).

Disclosed belongs to the technical field of displaying, and particularly relates to a sealant tape, a display panel and methods for manufacturing the same. The sealant tape comprises a substrate and an adhesive layer provided on at least one side of the substrate, wherein the substrate comprises a first elastomer, and the adhesive layer comprises a second elastomer and a crosslinking agent. Both of the substrate and the adhesive layer of the sealant tape are formed of elastomeric materials, and the adhesive layer further comprises a crosslinking agent to adjust the storage modulus thereof, such that the sealant tape can withstand a higher stress while provides excellent bending performance, and has a higher viscosity to ensure that it will not be unglued when the display panel is folded and thus it can be prevented from being damaged during folding or bending of the flexible display panel, ensuring good packaging performance.

Provided are: a composition for a window film, containing a siloxane resin including chemical formula 1, a cross-linking agent, and an initiator; a flexible window film formed therefrom; and a flexible display device including the same.